Business Wire

  1. Silicon Labs Launches Industry’s Fastest Isolated Current Sense Amplifier

    Silicon Labs, a leading provider of mixed-signal isolation technology for industrial automation and Internet infrastructure, recently introduced an isolated current sense amplifier delivering robust isolation and the industry’s highest bandwidth and lowest signal delay

  2. Seiko Instruments (SII) Releases High Accuracy Digital Temperature Sensor IC With Thermostat Function

    Seiko Instruments Inc. (SII) announced the release of the S-5852 Series, featuring both digital output with I2C interface for continuous temperature monitoring as well as a thermostat function (temperature switch) to signal out of range temperature conditions

  3. Digi International And Digi-Key Introduce New XBee Wireless Connectivity Kit

    Digi International, the M2M solutions expert, and Digi-Key Electronics, the industry leader in electronic component selection, availability and delivery, recently announced the availability of the Digi XBee Wireless Connectivity Kit (XKB2-AT-WWC)

  4. Hyper-Fast Rectifier From Diodes Incorporated Offers 600V 8A Performance For Power-Factor Correction Applications

    Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, recently introduced the DSR8F600

  5. Toshiba Starts Mass Production Of 5-Volt Constant Voltage Regulator ICs For Automotive Applications

    Toshiba Corporation's (TOKYO:6502) Semiconductor & Storage Products Company recently announced the start of mass production of "TB9005FNG" and "TB9021FNG", 5-volt constant voltage regulators for application in automotive systems

  6. HYPRES Increases Speed Of World’s Fastest Commercially-Available Superconductor Integrated Circuits

    HYPRES, Inc., the Digital Superconductor Company, announces that it now offers integrated circuit (IC) foundry services with the increased critical current density of 10 kA/cm2 with a minimum junction size of 0.7 micrometer in diameter

  7. Active-Semi Expands Power Application Controller (PAC) BLDC Motor Control Solutions With PAC5223 IC

    Active-Semi, Inc. ( announced recently further expansion of their Power Application ControllerTM (PACTM) based BLDC motor control portfolio with the addition of the PAC5223 IC, 4 new development kits and firmware solutions

  8. Molex TermiMate One-Circuit Terminal-Style Connector Minimizes LED Shadowing

    Molex Incorporated introduces the new TermiMate one-circuit terminal-style connector system

  9. Cree Announces The Signing Of A Global LED Chip Patent Cross-License Agreement With Epistar

    Cree, Inc. and Epistar Corporation have signed a worldwide patent cross-license agreement for light emitting diode (LED) chips to further advance the growth of the LED lighting and LED bulb markets

  10. Efficient Power Conversion (EPC) Introduces Extremely Fast, Small Monolithic Gallium Nitride Power Transistor Half Bridge Operating Over 2 MHz, Ideal For Class-D Audio

    EPC announces the EPC2106, an enhancement-mode monolithic GaN transistor half bridge