Business Wire

  1. Toshiba Launches DMOS FET Transistor Arrays With Industry's First 1.5A Sink-Output Driver

    Toshiba Corporation's Semiconductor & Storage Products Company recently announced the launch of a new generation of highly efficient transistor arrays, the TBD62064A series and TBD62308A series, with a DMOS FET[1] type sink- output[2] driver

  2. Pulse Electronics’ ProxAnt TL 1.0 Package Combines A Proximity Sensor With An Antenna To Optimize Both Functions

    Pulse Electronics Corporation introduces an all-in-one combination antenna and proximity sensor package to optimize the characteristics of both functions, thus enabling better device performance and increased design flexibility for tablets, laptops, and notebook computers.

  3. MACOM Acquires Aeroflex’s Diode Business From Cobham

    M/A-COM Technology Solutions Holdings, Inc. (MACOM), a leading supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, recently announced that it has acquired 100% of Aeroflex’s diode business for $38M in cash

  4. Analogix And Pinecone Collaborate On USB-C Technology

    Analogix Semiconductor, Inc. and Beijing Pinecone Electronics Co. Ltd., recently announced their licensing agreement of Analogix’s Intellectual Property (IP) for USB-C technology

  5. Renesas Electronics Delivers R-Car H3, First SoC From The Third-Generation R-Car Automotive Computing Platform For The Autonomous-Driving Era

    Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, recently unveiled the third-generation R-Car, an automotive computing platform solution for driving safety support systems and in-vehicle infotainment systems

  6. Rogers Corporation Signs Licensing Agreement With SBE Inc. For Industry-Leading Capacitor Busbar Assemblies

    Rogers Corporation, a global leader in engineered materials solutions, announced recently that it has signed an agreement to license technology that will enhance the Company’s capabilities in power distribution systems for electric and hybrid electric vehicles, renewable energy and industrial applications where efficiency, size and weight are critical factors

  7. Toshiba Unveils SOI Process Achieving The Lowest-Class Insertion Loss In The Industry For RF Switches In Smartphones

    Toshiba Corporation’s Semiconductor & Storage Products Company recently announced the development of “TaRF8”, a next generation TarfSOI (Toshiba advanced RF SOI) process optimized for radio-frequency (RF) switch applications that achieves the lowest-class of insertion loss in the industry.

  8. Garmin Team X Introduces Single Solution For Expanded Aircraft Systems Integration, Cost-Savings And Added Utility

    Garmin International Inc., a unit of Garmin Ltd., recently announced the GAD 27, a small, lightweight and solid state integrated controller that provides a solution to many of the typical airframe interfacing needs

  9. Themis Announces Ruggedized, Atlantis USX- Powered, All-Flash, Hyper-Converged Infrastructure Platform

    Themis Computer recently announces the immediate availability of Hyper-Unity, the first rugged all-flash hyper-converged, scalable infrastructure, featuring Atlantis USX

  10. Intel Architects High Performance Computing System Designs To Bring Power Of Supercomputing Mainstream

    Intel Corporation recently announced several advancements to its Intel Scalable System Framework (Intel SSF) that promise to bring high performance computing (HPC) capabilities and benefits to more industries and new workloads