Business Wire

  1. Parade Technologies Samples Industry’s First DisplayPort 1.4 Jitter Cleaning Repeater / Demux Devices

    Parade Technologies, Ltd. (Taiwan OTC: 4966.TWO), a leading high-speed interface IC supplier, recently announced two new jitter cleaning repeater chips designed for DisplayPort 1.3 and DisplayPort 1.4 enabled devices

  2. NuVolta’s Magnetic Resonance RX IC Enables High Efficiency 20W Wireless Charging At 6.78MHz

    On September 19, 2016, NuVolta Technologies Inc. announces that it has developed industry’s first 20W receiver IC based on its high efficiency Controlled Resonance wireless power architecture

  3. Mitsubishi Electric US And NextGen RF Release Second Design Kit To Simplify Design Process Of UHF Band Amplifiers Using Mitsubishis SiRF Devices

    Mitsubishi Electric US, Inc. and NextGen RF Design, Inc. have collaborated again to help accelerate the design of UHF band power amplifiers, with the introduction of the RD01 evaluation kit and associated reference design package

  4. IXYS IC Division Introduces New 250V 1-Form-A Solid State Relay

    IXYS Integrated Circuits Division (ICD), Inc., a wholly owned subsidiary of IXYS Corporation (NASDAQ:IXYS), announced the immediate availability of the CPC1010N, 250V, single-pole, normally open (1-Form-A) Solid State Relay (SSR) with a 170mA load current rating

  5. New SCALE-2 Plug-And-Play Gate Drivers From Power Integrations Suit A Wide Range Of IGBT Modules

    Power Integrations, the leader in IGBT and MOSFET driver technology for medium- and high-voltage inverter applications, recently introduced the 1SP0350V SCALE-2 single-channel +15/-10 V plug-and-play gate driver

  6. Toshiba's New Single-Chip Low Pin-Count MCU Realizes Multiple Motor Control

    Toshiba Corporation's Storage & Electronic Devices Solutions Company recently announced that it has developed a new group of microcontrollers, "M4K group" that allow a single-chip with a low pin-count (32 to 64 pins) to control multiple motors

  7. Low Noise Amplifier Family From MACOM Provides Industry-Leading Performance And Versatility Enabling Accelerated Time-To-Market For Customers

    MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance analog RF, microwave, millimeterwave and optical semiconductor products, recently introduced the MAAL-011129 and the MAAL-011130.

  8. Fraunhofer EMFT Signs Agreement To Implement ZiBond And DBI Technologies In MEMS Applications

    Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., announced recently that Fraunhofer EMFT has signed a new license agreement to incorporate ZiBond and Direct Bond Interconnect (DBI) technologies into their portfolio of foundry services

  9. New Alpha Electronics Precision SMD Bulk Metal Foil Resistors, Made In Japan In Fully Automated Process, Provide Competitive Pricing For OEMs

    VPG Foil Resistors, a Vishay Precision Group, Inc. product group, announced recently that its Alpha Electronics brand has introduced a new series of precision surface-mount Bulk Metal Foil resistors that are the first such devices to be manufactured in a fully automated process — providing competitive pricing in high-volume applications for OEMs

  10. SUSS MicroTec Launches Coat And Develop Solution For Advanced Packaging Applications

    SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, recently announced the launch of its new generation of the fully automated ACS300 platform