Latest Headlines
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Topanga Technologies Launches The APL1000 Light Engine, A New Ultra-Efficient Solution For High Mast, High Output Applications
4/17/2013
Topanga Technologies announced recently it has further expanded its Advanced Plasma Lighting (APL) product line with the introduction of APL1000, a long-lasting, energy-efficient lighting solution for commercial applications that require high brightness, broad spectrum, and uniform light output in a lightweight form factor
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Free Online Design Tools From Aspen Labs And Digi-Key Give Engineers An Edge In Online Printed Circuit Board Design
4/17/2013
Aspen Labs, innovators in the engineering business media field, and global electronic components distributor Digi-Key Corporation, the industry leader in electronic component selection, availability and delivery, are giving engineers access to a new set of free, online CAD tools to support Printed Circuit Board (PCB) design and development
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TE Connectivity Launches Core Vertical Switch Management Platform
4/17/2013
TE Connectivity (TE) recently announced a new application-driven solution for the unique cabling challenges presented by vertical blade-based core switch systems
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New DENSO QB30 Stationary 2-D Barcode Scanner
4/16/2013
DENSO ADC announced a new QB30 stationary 2-D barcode scanner that combines high-speed scanning and small size with rugged, element-resistant construction.
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Layered '2-D Nanocrystals' Promising New Semiconductor
4/15/2013
Researchers are developing a new type of semiconductor technology for future computers and electronics based on "two-dimensional nanocrystals" layered in sheets less than a nanometer thick that could replace today's transistors.
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VPG Announces First Ultra-High-Precision Z-Foil Surface-Mount Current Sensing Chip Resistor To Combine High Power To 1 W With Low TCR Of +/-0.2 ppm/°C
4/15/2013
Vishay Precision Group, Inc. recently announced that its Vishay Foil Resistors brand (VFR) has released a new ultra-high-precision Z-Foil surface-mount current sensing chip resistor that is the industry’s first such device to combine a high power rating of 1 W at +70°C and low TCR of ±0.2 ppm/°C typical from -55°C to +125°C, +25°C ref
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Murata Selects ANADIGICS 802.11ac FEIC For WiFi Module
4/10/2013
ANADIGICS, Inc., a world leader in radio frequency (RF) solutions, recently announced that its AWL9581 front-end integrated circuit (FEIC) is used in Murata’s latest WiFi module, which is now in mass production in support of high-volume smartphones equipped with 802.11ac WiFi technology.
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Next-Gen Products And Technologies On Display At UBM Tech's DESIGN West
3/21/2013
UBM Tech, which serves design engineers and the electronics industry with essential business and technical information, today announced the next-generation products and technologies that will be on display at DESIGN West, the annual technical conference and expo for electronics design engineers, entrepreneurs, and technology professionals who create products with electronic content
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Cornell Dubilier Announces Long-Life Ultracapacitors
3/21/2013
Cornell Dubilier Electronics, Inc. (CDE) announces the release of type EDLR long-life electric double layer capacitors
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NXP Launches Industry’s First Automotive-Grade Isolated CAN Transceiver
3/21/2013
Building on its industry-leading position in In-Vehicle Networking, NXP Semiconductors N.V. (Nasdaq: NXPI) today introduced the TJA1052i, a high-speed Controller Area Network (CAN) transceiver with integrated galvanic isolation technology
