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    <title>ElectronicsWeb News</title>
    <description>News Articles</description>
    <link>http://www.electronicsweb.com/</link>
    <pubDate>Thu, 22 Jul 2010 06:49:00 GMT</pubDate>
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      <title>Advanced Cooling System Being Developed For High-Power Military And Automotive Electronics</title>
      <description>Researchers have shown that an advanced cooling technology being developed for high-power electronics in military and automotive systems is capable of handling roughly 10 times the heat generated by conventional computer chips.</description>
      <link>http://www.electronicsweb.com/article.mvc/Advanced-Cooling-System-Being-Developed-For-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Thu, 22 Jul 2010 06:49:00 GMT</pubDate>
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      <title>New Microchip Development Board Makes It Easy And Cost-Effective To Design With 16-bit Microcontrollers And DSCs</title>
      <description>Microchip Technology Inc. announced the Microstick for dsPIC33F and PIC24H development board, which provides a complete, low-cost solution for designing with Microchip's 16-bit PIC24H microcontrollers and dsPIC33F Digital Signal Controllers (DSCs), in a compact 20x76 mm footprint. </description>
      <link>http://www.electronicsweb.com/article.mvc/New-Microchip-Development-Board-Makes-It-Easy-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Wed, 21 Jul 2010 12:00:00 GMT</pubDate>
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      <title>Samsung First To Begin Mass Producing 2-Gigabit Green DDR3 Using 30nm Class Technology</title>
      <description>Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry's first two-gigabit (Gb) Green DDR3 using 30 nanometer (nm) class* process technology. </description>
      <link>http://www.electronicsweb.com/article.mvc/Samsung-First-to-Begin-Mass-Producing-2-Gigab-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Wed, 21 Jul 2010 02:00:00 GMT</pubDate>
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      <title>Bluetooth SIG Launches Application Developers' Contest</title>
      <description>The Bluetooth Special Interest Group (SIG) today announced the opening of its Application Developers' Contest, which will allow users to take advantage of the various features that Bluetooth technology has to offer the wireless space. </description>
      <link>http://www.electronicsweb.com/article.mvc/Bluetooth-SIG-Launches-Application-Developers-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Tue, 20 Jul 2010 18:00:00 GMT</pubDate>
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      <title>Motion Named Microsoft 2010 United States OEM Partner of the Year</title>
      <description>Motion Computing, a leading provider of integrated mobile computing solutions, announced today that it was recognized as the Microsoft United States Original Equipment Manufacturer (OEM) Partner of the Year.</description>
      <link>http://www.electronicsweb.com/article.mvc/Motion-Named-Microsoft-2010-United-States-OEM-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Tue, 20 Jul 2010 16:55:00 GMT</pubDate>
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      <title>Avnet, Inc. Closes Tender Offer for Unidux, Inc.</title>
      <description>Avnet, Inc. announced today that, through its wholly-owned subsidiary, Avnet EM Holdings (Japan) Godo Kaisha, it has closed the tender offer bid for Unidux, Inc. (TSE: 9897). About 94.6 percent of the shares of Unidux's common stock were validly tendered, well above the 67 percent threshold set out in the offer document as a condition for Avnet to accept the tendered shares. </description>
      <link>http://www.electronicsweb.com/article.mvc/Avnet-Inc-Closes-Tender-Offer-for-Unidux-Inc-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Mon, 19 Jul 2010 19:30:00 GMT</pubDate>
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      <title>CEA-Leti: Wear-a-BAN - Unobtrusive Wearable Human To Machine Wireless Interface</title>
      <description>Communication between man and machine, also known as Human-Machine-Interface (HMI), could become more intuitive or natural by integrating motional and emotional information, parameters which are difficult to express with standard HMI devices. </description>
      <link>http://www.electronicsweb.com/article.mvc/CEA-Leti-Wear-a-BAN-Unobtrusive-Wearable-Huma-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Mon, 19 Jul 2010 14:48:00 GMT</pubDate>
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      <title>Small Wires Make Big Connections For Microelectronics</title>
      <description>University of Illinois engineers have developed a novel direct-writing method for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics.</description>
      <link>http://www.electronicsweb.com/article.mvc/Small-Wires-Make-Big-Connections-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Thu, 15 Jul 2010 10:59:00 GMT</pubDate>
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      <title>European Cooperation Ensures Global Leadership In Microelectronics</title>
      <description>Mass production of globally competitive electronics equipment relies heavily on the performance and availability of the latest microelectronics devices. The EUREKA MEDEA+ microelectronics Cluster FOREMOST project ensured that the advanced process modules and chip architectures required for full 45nm node CMOS logic and 50nm DRAM memory technologies are now being applied in European wafer-fabrication plants.</description>
      <link>http://www.electronicsweb.com/article.mvc/European-Cooperation-Ensures-Global-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Thu, 15 Jul 2010 10:02:00 GMT</pubDate>
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      <title>Graphene 2.0: A New Approach To Making A Unique Material</title>
      <description>Since its discovery, graphene - an unusual and versatile substance composed of a single-layer crystal lattice of carbon atoms - has caused much excitement in the scientific community. Now, Nongjian(NJ) Tao, a researcher at the Biodesign Institute at Arizona State University has hit on a new way of making graphene, maximizing the material's enormous potential, particularly for use in high-speed electronic devices. </description>
      <link>http://www.electronicsweb.com/article.mvc/Graphene-20-A-New-Approach-To-Making-A-Unique-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Fri, 02 Jul 2010 13:38:00 GMT</pubDate>
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      <title>Tasty New Standards For Systems-on-Chips </title>
      <description>European researchers have developed breakthrough standards that will let microchip designers integrate more complex circuits more easily. It will mean a faster design process, more energy and cost efficient microchips, and more sophisticated designs to meet complex tasks. </description>
      <link>http://www.electronicsweb.com/article.mvc/Tasty-New-Standards-For-Systems-on-Chips-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Fri, 25 Jun 2010 15:12:00 GMT</pubDate>
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      <title>e2v Releases The PC8349/E PowerQUICC II Pro Integrated Host Processor For Extended-Reliability Applications</title>
      <description>e2v, a leading designer and manufacturer of specialised electronic components, announced today the availability of their PC8349/E extended-reliability version of the MPC8349E 32-bit PowerQUICC II Core Processor from Freescale for aerospace and defence applications</description>
      <link>http://www.electronicsweb.com/article.mvc/e2v-Releases-The-PC8349E-PowerQUICC-II-Pro-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Wed, 23 Jun 2010 13:54:00 GMT</pubDate>
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      <title>Nanowires For The Electronics And Optoelectronics Of The Future</title>
      <description>Organic semiconductors are very promising candidates as starting materials for the manufacture of cheap, large area and flexible electronic components such as transistors, diodes and sensors on a scale ranging from micro to nano.</description>
      <link>http://www.electronicsweb.com/article.mvc/Nanowires-For-The-Electronics-And-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Wed, 23 Jun 2010 08:51:00 GMT</pubDate>
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      <title>austriamicrosystems Introduces The Industry's Highest Efficiency Series Of Dual DC-DC Converters</title>
      <description>austriamicrosystems, a leading global designer and manufacturer of high performance analog ICs has introduced the industry's highest efficiency high current, dual step-down DC-DC converters in a compact 3x3 mm TDFN package. For space-limited applications with low power consumption requirements, the new AS134x series provides small size and high efficiency -- up to 95% -- for maximum time between battery charges</description>
      <link>http://www.electronicsweb.com/article.mvc/austriamicrosystems-Introduces-The-Industrys-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Wed, 23 Jun 2010 06:27:00 GMT</pubDate>
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      <title>Technology Leaders &amp;amp; Innovators Selects Berkeley Design Automation Analog FastSPICE Platform</title>
      <description>Berkeley Design Automation, Inc., provider of the Analog FastSPICE unified circuit verification platform (AFS Platform), today announced that Technology Leaders &amp;amp; Innovators (TLi), a leading fabless developer of display semiconductor products, has selected the AFS Platform for full-circuit verification and device noise analysis of its complex mixed-signal ICs for display applications</description>
      <link>http://www.electronicsweb.com/article.mvc/Technology-Leaders-Innovators-Selects-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Tue, 22 Jun 2010 15:30:00 GMT</pubDate>
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      <title>Laird Technologies To Attend Automation 2010 Trade Show</title>
      <description>Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, recently announced it will be attending the Automation 2010 trade show for South China. The trade show is being held at the Shenzhen Convention &amp; Exhibition Center in Shenzhen, China, June 24-26, 2010</description>
      <link>http://www.electronicsweb.com/article.mvc/Laird-Technologies-To-Attend-Automation-2010-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Tue, 22 Jun 2010 08:24:00 GMT</pubDate>
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      <title>Mouser First To Stock KEMET Power Solutions (KPS) Single And Double Chip Stacked Multilayer Ceramic Capacitors</title>
      <description>Mouser Electronics, Inc., known for its rapid introduction of the newest products, recently announced it is the first to stock the KEMET Power Solutions (KPS Series) MLCC Capacitors</description>
      <link>http://www.electronicsweb.com/article.mvc/Mouser-First-To-Stock-KEMET-Power-Solutions-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Tue, 22 Jun 2010 06:13:00 GMT</pubDate>
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      <title>NanoMarkets Report: Smaller Electronic Devices Create Growing ESD Problems For Manufacturers And End Users</title>
      <description>Smaller electronic components are creating greater risks for electronics manufacturers and mission-critical operations, according to a new study from NanoMarkets regarding the growing threat of ESD (electrostatic discharge)</description>
      <link>http://www.electronicsweb.com/article.mvc/Smaller-Electronic-Devices-Create-Growing-ESD-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Mon, 21 Jun 2010 16:00:00 GMT</pubDate>
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      <title>Diodes Incorporated Launches Miniature SOT963 Packaged Devices For Ultra Portable Electronics</title>
      <description>Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, today has introduced bipolar transistor, MOSFET, and TVS devices in the ultra small SOT963 package, achieving the same or better performance of much larger packaged parts</description>
      <link>http://www.electronicsweb.com/article.mvc/Diodes-Incorporated-Launches-Miniature-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Mon, 21 Jun 2010 13:00:00 GMT</pubDate>
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      <title>Researchers Develop New Method For Mass-Producing Graphene</title>
      <description>Researchers at Rensselaer Polytechnic Institute have developed a simple new method for producing large quantities of the promising nanomaterial graphene. The new technique works at room temperature, needs little processing, and paves the way for cost-effective mass production of graphene.</description>
      <link>http://www.electronicsweb.com/article.mvc/Researchers-Develop-New-Method-For-Mass-0001?atc~c=771+s=773+r=001+l=a</link>
      <pubDate>Mon, 21 Jun 2010 09:38:00 GMT</pubDate>
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