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Today 3DSP Corp. and ATI Technologies, Inc. (Irvine, CA) announced that ATI has licensed DSP technology from 3DSP. The SP-3 is a high-performance DSP core suitable for wireless data, audio and speech processing that is capable of a sustained DSP throughput of 400 million 16-bit multiply-accumulate instructions per second (MMACS), at a clock frequency of 200 MHz. The SP-3 occupies 0.9 mm² in a 0.18-µm process and consumes about 50 mW. The SP-3 is supplied as VHDL or Verilog code, enabling ASIC or SoC designers to easily integrate the DSP subsystem and to target the design to any silicon foundry.

Other products from 3DSP include the SP-5 and SP-X DSP cores. The SP-5 is capable of sustained delivery of 1,000 MMACS at 250MHz, making it a good choice for such high-performance applications as DSL modems and voice over IP gateways. The SP-X is a parameterized version of the SP-5 that enables customers, via the HiFI (Highly Flexible, Integrated) Assisted Design Environment (ADE), to generate a core tailored specifically to their needs, including the ability to add instructions and new datapath elements. All three cores are software-compatible, covering a broad span of applications with a single instruction-set architecture. A full complement of software-development tools, including a C-compiler, simulation model and RTOS is also available from 3DSP.

Edited by David Maliniak
Managing Editor, ElectronicsWeb.com

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