Molex has introduced Solder on Polyester Substrate, a flexible, economical alternative to rigid PCB and polyimide. Surface Mount (SMT) components, including fine-pitched integrated circuits (ICs) are attached with low-temperature solder and encapsulated on a polyester substrate
Renesas Electronics Corporation, a premier provider of advanced semiconductor solutions, recently announced its latest innovative developments in Ethernet time-sensitive networking (TSN)
MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers 0.13 micron EEPROM- based RF-CMOS technology. This RF-CMOS process was developed using a P-type substrate, which is tailored specifically for wireless applications.
Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets, recently introduced the AL8860
Taoglas, a leading provider of IoT and M2M antenna solutions, has developed a range of Ultra-Wide Band (UWB) antennas, offering more practical and easily integrated solutions than ever before.
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