Toshiba Develops World's First 256Gb, 48-Layer BiCS FLASH
Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today unveiled the new generation of BiCS FLASH™, a three-dimensional (3D) stacked cell structure flash memory.
NextInput Announces Distribution Agreement With EDOM Technology
NextInput Inc. announced recently that it has signed a distribution agreement with Taiwan-based EDOM Technology Co. Ltd., a leading integrated circuit distributor in Asia
Renesas Electronics Introduces 16- And 32-Megabit Advanced Low Power SRAMs With Over 500 Times The Resistance To Soft Errors Compared To Full CMOS Memory Cells
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, recently announced the release of two new series of Advanced Low Power SRAM (Advanced LP SRAM), the leading type of low-power-consumption SRAM, designed to provide enhanced reliability and longer backup battery life for applications such as factory automation (FA), industrial equipment, and the smart grid
Seiko Instruments: New Reflowable And Low Impedance Chip-Type Capacitor
Seiko Instruments Inc. (SII) is pleased to announce that it is expanding its lineup of chip-type Electric Double Layer Capacitor (EDLC)
High-Performance Automotive Hall Effect Latch From Diodes Incorporated Features Wide Range Of Sensitivity Options
Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, recently introduced the AH376xQ family of AECQ100-qualified Hall effect latches
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