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Advanced Cooling System Being Developed For High-Power Military And Automotive Electronics
7/28/2010
Researchers have shown that an advanced cooling technology being developed for high-power electronics in military and automotive systems is capable of handling roughly 10 times the heat generated by conventional computer chips.
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New Microchip Development Board Makes It Easy And Cost-Effective To Design With 16-bit Microcontrollers And DSCs
7/21/2010
Microchip Technology Inc. announced the Microstick for dsPIC33F and PIC24H development board, which provides a complete, low-cost solution for designing with Microchip's 16-bit PIC24H microcontrollers and dsPIC33F Digital Signal Controllers (DSCs), in a compact 20x76 mm footprint.
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Small Wires Make Big Connections For Microelectronics
7/21/2010
University of Illinois engineers have developed a novel direct-writing method for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics.
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European Cooperation Ensures Global Leadership In Microelectronics
7/21/2010
Mass production of globally competitive electronics equipment relies heavily on the performance and availability of the latest microelectronics devices. The EUREKA MEDEA+ microelectronics Cluster FOREMOST project ensured that the advanced process modules and chip architectures required for full 45nm node CMOS logic and 50nm DRAM memory technologies are now being applied in European wafer-fabrication plants.
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Samsung First To Begin Mass Producing 2-Gigabit Green DDR3 Using 30nm Class Technology
7/20/2010
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry's first two-gigabit (Gb) Green DDR3 using 30 nanometer (nm) class* process technology.
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Bluetooth SIG Launches Application Developers’ Contest
7/20/2010
The Bluetooth Special Interest Group (SIG) today announced the opening of its Application Developers' Contest, which will allow users to take advantage of the various features that Bluetooth technology has to offer the wireless space.
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Motion Named Microsoft 2010 United States OEM Partner of the Year
7/20/2010
Motion Computing, a leading provider of integrated mobile computing solutions, announced today that it was recognized as the Microsoft United States Original Equipment Manufacturer (OEM) Partner of the Year.
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Avnet, Inc. Closes Tender Offer for Unidux, Inc.
7/19/2010
Avnet, Inc. announced today that, through its wholly-owned subsidiary, Avnet EM Holdings (Japan) Godo Kaisha, it has closed the tender offer bid for Unidux, Inc. (TSE: 9897). About 94.6 percent of the shares of Unidux's common stock were validly tendered, well above the 67 percent threshold set out in the offer document as a condition for Avnet to accept the tendered shares.
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CEA-Leti: Wear-a-BAN – Unobtrusive Wearable Human To Machine Wireless Interface
7/19/2010
Communication between man and machine, also known as Human-Machine-Interface (HMI), could become more intuitive or natural by integrating motional and emotional information, parameters which are difficult to express with standard HMI devices.
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Graphene 2.0: A New Approach To Making A Unique Material
7/2/2010
Since its discovery, graphene — an unusual and versatile substance composed of a single-layer crystal lattice of carbon atoms — has caused much excitement in the scientific community. Now, Nongjian(NJ) Tao, a researcher at the Biodesign Institute at Arizona State University has hit on a new way of making graphene, maximizing the material's enormous potential, particularly for use in high-speed electronic devices.
