Business Wire

1. Power Integrations’ New 200 V Qspeed Diodes Combine Low Recovery Losses And Softness To Optimize Efficiency And Minimize EMI
   5/14/2013

   Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, recently introduced the LQA200 series of 200 V diodes

2. TowerJazz And TLi Korea Collaborate On Sensor ICs Targeting $1.7B Worldwide Mobile Phone Market
   5/13/2013

   TowerJazz, the global specialty foundry leader, recently announced collaboration with TLi (Technology Leaders & Innovators), a fabless company that designs non-memory integrated circuits (ICs) focused on timing controllers and driver ICs on TFT-LCD panel modules

3. Peregrine Semiconductor Introduces Latest SPDT RF Switch For Harsh Space Environments
   5/13/2013

   Peregrine Semiconductor Corporation, a fabless provider of high-performance radio frequency integrated circuits (RFICs), recently announced availability of a new SPDT RF switch for harsh environment and space applications

4. AEG Power Solutions Introduces Modular PV Inverter For U.S. Commercial Applications
   5/13/2013

   AEG Power Solutions (AEG PS) is pleased to introduce the new modular photovoltaic (MPV) solar inverter, with leading-edge power electronics in a transformerless, modular design

5. Sensor Platforms Optimizes Sensor Fusion Software For NVIDIA Tegra 4
   5/13/2013

   Sensor Platforms recently announced that its FreeMotion Library of sensor fusion software is now ported to, and optimized for, the NVIDIA Tegra 4 mobile processor reference platform, and is available for licensing by smartphone and tablet makers

6. Silicon Labs Digital Isolation Solution Enhances Long-Term Reliability Of Motor Controls
   5/8/2013

   Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal ICs, recently introduced the industry’s first digital CMOS-based drop-in replacement solution for optocoupler-isolated gate drivers (opto-drivers)

7. Microchip Expands LIN 2.1/ SAE J2602-2 Portfolio With New Transceiver, System Basis Chip And System-In-Package Devices
   4/30/2013

   Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the expansion of its LIN portfolio with the LIN 2.1 and SAE J2602-2 compliant and low-power MCP2003A transceiver, MCP2021A, MCP2022A, MCP2025 and MCP2050 LIN System Basis Chips (SBCs), and PIC16F1829LIN System in Package (SiP).

8. Renesas Electronics Adds Miniaturization, Power-Savings Enhancements To The RL78 Family Of Ultra Low Power Microcontrollers
   4/17/2013

   Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has developed the RL78/G10 Group as low pin count versions of the RL78/G1x Series of microcontrollers (MCUs) that feature excellent low-power operation as well as superb processing performance with on-chip flash memory capacities from 1 to 4 KB in 10-pin SSOP (Shrink Small Outline Package) and 16-pin SSOP packages

9. Topanga Technologies Launches The APL1000 Light Engine, A New Ultra-Efficient Solution For High Mast, High Output Applications
   4/17/2013

   Topanga Technologies announced recently it has further expanded its Advanced Plasma Lighting (APL) product line with the introduction of APL1000, a long-lasting, energy-efficient lighting solution for commercial applications that require high brightness, broad spectrum, and uniform light output in a lightweight form factor

10. Free Online Design Tools From Aspen Labs And Digi-Key Give Engineers An Edge In Online Printed Circuit Board Design
    4/17/2013

    Aspen Labs, innovators in the engineering business media field, and global electronic components distributor Digi-Key Corporation, the industry leader in electronic component selection, availability and delivery, are giving engineers access to a new set of free, online CAD tools to support Printed Circuit Board (PCB) design and development