Latest Headlines
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Empower Introduces High-Density Embedded Silicon Capacitors To Advance Next-Generation AI And HPC Performance
2/10/2026
Empower Semiconductor, the world leader in powering artificial intelligence (AI)-class processors, today announced the launch of three new embedded silicon capacitors (ECAP), designed to meet the power integrity demands of next-generation AI and high-performance computing (HPC) processors.
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VPT Expands NewSpace VSC Series With High-Efficiency Point Of Load DC-DC Converter
2/4/2026
VPT, Inc., a HEICO company (NYSE:HEI.A) (NYSE:HEI), announces the release of the VSCPL1210SG, the first point of load DC–DC converter in its award–winning VSC Series of space–grade COTS power supplies.
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EPC Launches Its First Seventh-Generation (Gen 7) eGaN Power Transistor, The 40 V EPC2366, Into Mass Production
2/2/2026
Efficient Power Conversion (EPC), the world leader in enhancement-mode gallium nitride (eGaN) power devices, announces the start of volume production of the EPC2366, the first of its seventh-generation (Gen 7) eGaN family of power transistors.
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Nuvoton Releases High-Power Ultraviolet Laser Diode (379 nm, 1.0 W)
1/20/2026
Nuvoton Technology Corporation Japan (hereinafter "NTCJ") announced on January 20 the start of mass production of its high-power ultraviolet semiconductor laser (379 nm, 1.0 W), which delivers industry-leading (*) optical output in a 9.0-mm diameter CAN package (TO-9).
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ROHM Adds Wide SOA MOSFETs For AI Servers With Compact 5 x 6mm Package
1/20/2026
ROHM Co., Ltd. has developed the 100V power MOSFET--RS7P200BM--achieving industry-leading safe operating area (SOA) performance in a 5060-size (5.0mm x 6.0mm) package.
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PCBAIR Upgrades Heavy-Copper PCBs To Solve AI Thermal Bottlenecks
1/19/2026
As computational demands for AI models surge, the hardware powering them faces a critical physical limitation: thermal management.
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Heilind Features Molex SideWize High-Voltage Connectors For Space-Constrained Interconnect Designs
1/19/2026
Heilind Electronics, a leading global distributor of connectors and electromechanical components, is excited to announce the addition of the Molex SideWize High-Voltage Connectors to its expanding portfolio of high-power interconnect solutions.
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HKU Engineering Researchers Develop Soft, 3D Transistors With Hosting Living Cell Potential, Featured On Science Cover
1/15/2026
The WISE research group (Wearable, Intelligent, Soft Electronics) at The University of Hong Kong (HKU-WISE) have addressed a long-standing bioelectronic challenge: the development of soft, 3D transistors.
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Vishay Intertechnology Extends 193 PUR-SI Series Of Snap-in Power Aluminum Capacitors With Voltage Ratings Of 550 V And 600 V
1/14/2026
Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company has extended its 193 PUR-SI series of miniature snap-in power aluminum electrolytic capacitors with new voltage ratings of 550 V and 600 V.
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Siemens Acquires ASTER Technologies To Deliver Industry-Leading PCB Test Engineering Solutions
1/13/2026
Siemens today announced it has acquired ASTER Technologies (“ASTER”), a privately held market leader in printed circuit board assembly (PCBA) test verification and engineering software.