Advanced Semiconductor Engineering, Inc., and Cadence Design Systems, Inc., recently announced they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages
Toshiba Electronic Devices & Storage Corporation recently announced the development of “TaRF10,” a next generation TarfSOI (Toshiba advanced RF SOI) process optimized for low-noise amplifiers (LNAs) in smartphone applications.
Fairview Microwave Inc., a supplier of on-demand microwave and RF components, has released a new line of high-speed end launch connectors. They are ideal for signal integrity measurements, chip evaluations, coplanar waveguide, 25 GbE, SERDES, substrate characterization and test fixture applications.
Molex, a global provider of integrated electronic products, will showcase high-speed data connectivity solutions at DesignCon 2018 in Santa Clara, CA, January 31-February 1, 2018
Vishay Intertechnology, Inc. (NYSE:VSH) today introduced a new series of wirewound noise suppressor resistors that delivers improved voltage performance and reliability for automotive ignition systems in reciprocating engines
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