Dynatex International
Stability. Founded in 1958, Dynatex has grown along with the semiconductor industry by providing, first, dicing blades and, later, lubricants, solvents, disposable substrates, bonding and expanding equipment and other tools used in wafer die separation.
Solutions. Today, Dynatex addresses the dicing needs of devices with III-V compound substrates, including gallium arsenide, gallium phosphide and indium phosphide. In response to the surge in growth of this industry segment, the company developed the first automated scribe and break system in 1993, the DX-III. This revolutionary system has found use in a broad range of new applications from commodity silicon circuits to biotechnology devices, electro-optics and solid state laser manufacturing.
Innovation. With a complete line of dicing tools and materials, and nearly four decades of experience, Dynatex offers a strong base of technical accomplishment and business expertise to assist you with your specific product requirements.