Latest Headlines

  1. Universal Electronics Announces Additional SMT Manufacturing
    1/5/2018

    Universal Electronics, Inc. (UEI) has increased its RoHS compliant printed circuit board and higher-level assembly electronics manufacturing capabilities with the addition of new capital equipment for its manufacturing facilities in Whitewater and East Troy, WI

  2. IXYS Announces 200V Ultra-Junction X3-Class Power MOSFETs With Fast Body Diodes And Lowest On-Resistances
    12/29/2017

    IXYS Corporation (NASDAQ:IXYS), a global manufacturer of power semiconductors and integrated circuits (ICs) for energy efficiency, power management, transportation, medical, and motor control applications, today announced a new power semiconductor product line: 200V Ultra-Junction X3-Class HiPerFET™ Power MOSFETs. The current ratings range from 36A to 300A; a broad selection of devices are available in a number of international standard packages

  3. Vishay Intertechnology’s First AEC-Q100 Qualified Analog Switch Improves Signal Integrity And Bandwidth For Automotive Applications
    12/29/2017

    Vishay Intertechnology, Inc. (NYSE:VSH) today introduced a new AEC-Q100 (Grade 1) qualified dual DPDT / quad SPDT analog switch featuring low resistance of 0.37 Ω at 2.7 V and 338 MHz bandwidth in the compact 2.6 mm by 1.8 mm by 0.55 mm miniQFN16 package

  4. KEMET Receives Defense Logistics Agency Approval For MIL-PRF-32535 ‘M’ And ‘T’ Levels
    12/18/2017

    KEMET Corporation(NYSE:KEM), a leading global supplier of electronic components, today announced that the Defense Logistics Agency (DLA) has accepted KEMET’s qualification of C0G and BP dielectrics to MIL-PRF-32535 “M” and “T” levels making them the first base metal electrode (BME) MLCCs qualified for defense and aerospace applications

  5. Remcom Announces Circuit Co-Simulation In XFdtd Electromagnetic Simulation Software
    12/13/2017

    Remcom announces circuit co-simulation and expanded signal integrity capabilities in the latest update to XFdtd® 3D Electromagnetic Simulation Software

  6. Endura Technologies Announces Availability Of ET7730 - Industry's Smallest 6A Embedded Voltage Regulator (eVR™) Solution In 1mm(3) Volume, Operating At 130MHz
    12/5/2017

    Today, Endura Technologies (International) Ltd, announced the ET7700 product family, the industry's first 28nm embedded voltage regulator (eVR™)

  7. THine Announces Yamaichi Electronics’ Development Of Flexible Printed Circuit Cable For THine’s Next-Generation High-Speed Interface Specification, V-by-One US
    12/5/2017

    THine Electronics, Inc., the global leader in high-speed serial interface and provider of mixed-signal LSI, has been collaborating with several partners in development of transmission lines for THine’s next-generation high-speed interface specification for 4K and 8K video images, V-by-One US, and Yamaichi Electronics Co., Ltd., one of THine’s partners, will deliver sample products of flexible printed circuit cable that provides potential compliance with V-by-One US specification

  8. Mercury Systems Unveils First SpectrumSeries OpenRFM-Compliant Microwave Transceiver
    11/28/2017

    Mercury Systems, Inc. recently announced the new SpectrumSeries RFM3101 ultra-wideband microwave transceiver at the 54th Annual AOC International Symposium & Convention in Washington, DC. Designed in accordance with OpenVPX standards, Mercury’s new product integrates OpenRFM-compliant receiver and transmitter building blocks with versatile local oscillator (LO) circuitry to deliver exceptional phase noise and high dynamic range performance.

  9. Ardent Concepts Releases User-Friendly Design Update To Its TR Series Multicoax Connector
    11/9/2017

    Ardent Concepts, Inc., a leading designer and manufacturer of high performance GHz connectors used in the development of next generation semiconductor applications has released a new design of its 20, 40, & 70 GHz Straight Mount TR Multicoax series connector

  10. Cornell Dubilier Introduces Very Low-Profile Aluminum Electrolytic Capacitors That Breaks Energy Density Barriers
    11/2/2017

    Cornell Dubilier Electronics, Inc. (CDE) has announced a significant new development in aluminum electrolytic technology. Its 85 ºC THA Series Thinpack capacitors are only 8.2mm thick, and 9mm for the 105 ºC THAS Series