1.0mm Pitch BGA/CSP Hybrid Socket

Aries Electronics, a leader in standard and custom interconnection and packaging technology, has introduced a hybrid socket featuring a unique spring-type contact for use in both ball grid array (BGA) and chip scale packaging (CSP) applications.

The new sockets are currently offered with pitches of 1.0 mm and above, and can be furnished with pitches down to 0.5 mm for CSP applications.

Bolting the socket base down to the target board makes spring contact with that board. When the socket cover is attached to the base, the balls of the BGA device mate with the spring contacts.

The socket employs four threaded inserts for bolting the cover to the socket base (the cover-attach screws are provided with the socket). The socket housing also contains two locating pins to align the socket contacts precisely to the target board pads.

Each socket is matched to the BGA device to ensure a perfect fit. The socket base, contact housing (interposer) and cover are made of unfilled PEEK. The contact springs are BeCu C17200 plated with 30p of gold over nickel.

Aries Electronics, 62A Trenton Ave., PO Box 130, Frenchtown, NJ 08825-0130. Tel: 908-996-6841; Fax: 908-996-3891.