Samsung Brings In-memory Processing Power To Wider Range Of Applications8/24/2021
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today showcased its latest advancements with processing-in-memory (PIM) technology at Hot Chips 33 — a leading semiconductor conference where the most notable microprocessor and IC innovations are unveiled each year
eTopus Selects Diakopto's ParagonX™ Platform For Ultra-High Speed SerDes IP8/24/2021
Diakopto announced today that eTopus, a pioneer of ultra-high speed ADC/DSP-based SerDes for wireline applications, has chosen the ParagonX platform and methodology for integrated circuits (IC) debugging and design improvement
BAE Systems Collaborates With GLOBALFOUNDRIES To Produce Radiation-Hardened Single Board Computers For Space8/23/2021
BAE Systems’ radiation-hardened RAD510 System on Chip (SoC) for space-based computing is entering fabrication. Designed by BAE Systems and manufactured by GLOBALFOUNDRIES (GF), the RAD510 SoC will be the core of a single board computer (SBC) with twice the performance capability of the industry standard RAD750 microprocessor
Alpha And Omega Semiconductor Introduces Digital Multiphase Controller For Telecom And General-Purpose Applications8/18/2021
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of power semiconductors, power ICs, and digital power products, today introduces the first product of the AOS Digital Controller product portfolio.
EMA Design Automation And Digi-Key Electronics Collaborate To Offer New Supply Chain-Driven Design Product For OrCAD8/17/2021
EMA Design Automation® (http://www.ema-eda.com), a full-service provider and innovator of Electronic Design Automation (EDA) solutions, and Digi-Key Electronics, which offers the world's largest selection of in-stock and ready-to-ship electronic components, have collaborated to release the OrCAD® Capture Bundle, a special offer available only on digikey.com
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