LATEST HEADLINES

• Power Integrations Extends Flyback Topology To Enable 440 W, Offering Simpler Alternatives To Resonant Power Designs

  3/23/2026

  Power Integrations the leader in high-voltage integrated circuits for energy-efficient power conversion, today introduced a breakthrough in flyback topology extending the power range of flyback converters to 440 W—well beyond the limits that traditionally required more complex resonant and LLC topologies.

• SimpleChips Ships Industry's First 1200V High-Voltage Monitor IC

  3/19/2026

  APEC 2026 — In booth 2218, SimpleChips Technology Inc., a global provider of analog and mixed-signal application-specific integrated circuits (ASICs) for automotive, medical, industrial and aerospace applications, today announced the availability of the 18SCT005, the industry’s first 1200V high-voltage monitor IC.

• Interstate Connecting Components (ICC) Announces Addition Of Amphenol Fiber Systems VITA 87 High-Density MT Connectors

  3/19/2026

  Interstate Connecting Components (ICC), a leading distributor of electronic components for the military and aerospace industries, announces a new product introduction of Amphenol Fiber Systems VITA 87 high-density circular MT connectors.

• Toshiba Releases Photovoltaic-Output Photocoupler For Automotive Equipment

  3/18/2026

  Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched a photovoltaic-output photocoupler, "TLX9920", in a thin, long-creepage-distance SO6L package, for solid state relays (SSR)^[1] in automotive equipment. Volume shipments start today.

• Molex Accelerates AI Cluster Deployment With One-Stop Optical Interconnect Architecture And Debut Of High-Radix Optical Circuit Switch Platform

  3/17/2026

  Molex, a global electronics leader and connectivity innovator, has unveiled a robust product roadmap for delivering the full technology stack needed to address the massive scaling requirements of hyperscale data centers.