Toshiba Electronic Devices & Storage Corporation ("Toshiba") recently starts shipments of two low capacitance TVS diodes (ESD protection diodes) that support high speed communication standards, such as Thunderbolt 3, HDMI 2.1 and USB 3.1.
Vishay Intertechnology, Inc. (NYSE: VSH) today introduced three new Automotive Grade IHLP® low profile, high current inductors in the company’s smallest automotive-qualified case size to date: the 3.3 mm by 3.3 mm 1212.
Keysight Technologies, Inc., a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced an extended collaboration with Integrated Device Technologies, Inc. (IDT), a wholly owned subsidiary of Renesas Electronics Corporation, on component characterization of 5G new radio (NR) mmWave integrated circuit (IC) beamformers to accelerate development of 5G NR base stations.
EPC announces successful AEC Q101 qualification of the 15 V EPC2216 designed for lidar applications where increased accuracy is vital such as in self-driving cars and other time-of-flight (TOF) applications, including facial recognition, warehouse automation, drones and mapping.
TDK Corporation today announced that is has added to its portfolio of EPCOS film capacitors for DC link applications with the B3277*X/Y/Z series.
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