LATEST HEADLINES
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Mitsubishi Electric To Ship Samples Of S1-Series HVIGBT Module12/22/2024
Mitsubishi Electric Corporation announced today that it will begin shipping samples of two new S1-Series High Voltage Insulated Gate Bipolar Transistor (HVIGBT) modules, both rated at 1.7kV, for large industrial equipment such as railcars and DC power transmitters from December 26.
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Richardson Electronics, Ltd. Announces Two Multi-Million Dollar Contracts For Its Patented Ultracapacitor Pitch Energy Modules12/17/2024
Richardson Electronics, Ltd. (NASDAQ: RELL), a global provider of engineered solutions for renewable energy and other power management applications, announced today two multi-million dollar production contracts with two of the world's largest owners and operators of wind farms in North America for Richardson’s patented ultracapacitor pitch energy modules (PEMs) and other related products.
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KYOCERA AVX Releases Industry's Highest Power 0603 Resistor12/12/2024
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, expanded its selection of CR Series high-power chip resistors with the addition of the industry’s highest power 0603 resistor.
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Inductors: TDK Launches The Industry's Smallest Thin-Film Power Inductors12/12/2024
TDK Corporation announces the introduction of its new PLE856C Series (0.80 x 0.45 x 0.65 mm; L x W x T) of compact thin-film power inductors for wearable devices. Mass production of these new components began this month, in December 2024.
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OKI Develops Printed Circuit Board Technology With Stepped Copper Coin Insertion To Achieve 55 Times Better Heat Dissipation In Outer Space12/11/2024
The OKI Group printed circuit board (PCB) business company OKI Circuit Technology (President: Masaya Suzuki; Headquarters: Tsuruoka City, Yamagata Prefecture; “OTC” hereinafter) has successfully developed multi-layer PCB technology with stepped copper coin insertion (“stepped copper coin” hereinafter) to achieve 55 times better heat dissipation compared to conventional PCB (Note 1).
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