Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of LVAC power capacitors featuring ESTAspring, the industry’s first lever-operated spring terminal connection
Cadence Design Systems, Inc. recently announced TSMC certified Cadence’s design solutions for the new TSMC System-on-Integrated-Chips (TSMC-SoIC) 3D advanced chip stacking technology, which integrates heterogeneous chips—including logic ICs and memory—that are fabricated on different process nodes onto a single chip stack for a subsequent packaging process
HyperX, the gaming division of Kingston Technology, Inc., recently announced the release of two new high speed Predator DDR4 memory kits in 4266MHz and 4600MHz frequency versions
Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets, recently introduced a ReDriver for the server, storage, and networking market segment
ROHM today announced a new lineup of its PrestoMOSTM series, R60xxJNx series, of 600V super junction MOSFETs that includes 30 new models
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