Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series
Source: CTS Electronic Components
The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.
VIEW THE DATASHEET!
Log In
Signing up provides unlimited access to:
Free Sign Up
Signing up provides unlimited access to:
- Trend and Leadership Articles
- Case Studies
- Extensive Product Database
- Premium Content
HELLO. PLEASE LOG IN.
X
Not yet a member of ElectronicsWeb? Register today.
ACCOUNT SIGN UP
X
Please fill in your account details
ACCOUNT SIGN UP
This website uses cookies to ensure you get the best experience on our website. Learn more