El-Cast Resins
EL-CAST 760 is a filled, medium viscosity, high temperature potting and encapsulating resin. Excellent impact resistance, thermal shock resistance, thermal conductivity and high deflection temperature. Ideal for control units, transformers, noise filters, etc.
EL-CAST VFR is a filled, low viscosity, high temperature potting and encapsulating resin. Underwriter Laboratory (U.L.) approved at 94 VO. Resin has low odor, excellent air release, excellent bonding properties, high gloss finish with minimal shrinkage. Ideal for transformers, alarm systems, filters, magnetic components.
EL-CAST SS is a filled, general purpose potting resin. High thermal conductivity, high strength and low cost. Ideal for all applications requiring a tough protective system with high mechanical and physical properties.
EL-CAST 1-F-5 TAB & TAB-SR are filled, medium viscosity resins that can be used as a one or two component systems with excellent thermal conductivity and high temperature resistance. Exhibits good chemical resistance and excellent adhesion at high temperature with a room temperature or a heat cure at 160°F Ideal for transformers, filters, coils and all applications where heat cure is possible.
EL-CAST 1-F-5 TAB VO is a filled, high viscosity, high temperature one component system. Underwriter Laboratory (U.L.) approved at 94 V0. Exhibits low odor, good air release, high gloss finish, and good thermal conductivity. When heated to 80° - 90°F, viscosity will become very low and requires heat cure at 160°F Ideal for filters, transformers, coils, etc.
E-CAST F-28 is an unfilled, medium viscosity, good flowing resin. Excellent adhesion, clarity and room temperature rigid cure. Ideal for all applications where internal viewing is required.
E-CAST F-82 is an unfilled, low viscosity resin with high strength adhesion, good air release. Ideal for the most intricate applications, circuit boards, etc.
E-CAST W.G. is an unfilled, low viscosity, clear potting and encapsulating resin. Excellent adhesion and low viscosity allows for the most intricate applications. Ideal for circuit boards, power supplies, etc.
CONDUCTIVE EPOXY is a high strength, heat resistant, silver filled system, which can be cured at ambient or elevated temperatures.
E-CAST HEP is an unfilled, low viscosity resin. Excellent adhesion, low shrinkage, high gloss finish, and able to tolerate high temperatures. Ideal for film and metal capacitors, final capacitors and general potting and encapsulating applications.
VIBRAFLEX is a vibration dampening, flexible epoxy system featuring low exotherm, good thermal shock, low shrinkage, and the ability to be cut easily into for repair of components. Specially formulated for electronic underfill applications (glop top), adhering board devices and reducing the impact of shock and vibration on all parts.
UNI-CAST HAS is an unfilled, low viscosity resin with high strength, good flexibility and good chemical resistance. Ideal for circuit boards, intricate applications, etc.
CIRCUIT BOND & CIRCUIT BOND L.V.(Low Viscosity) area heat curing one-component, thixotropic adhesive for bonding surface mounted devices to circuit boards and all electronic adhesive applications.
United Resin Corporation, 1305 E. St. Gertrude Place, Unit B, Santa Ana, CA 92705. Tel: 714-662-2404; Fax: 714-662-2401.