HPM-5 (High Performance Modular) 2mm pitch, High Speed Cabling System
With today's systems requiring more speed and increased bandwidth, we redesigned our strain relief system to eliminate overmolding of the cable. Overmolding of the cable can cause impedance spikes and unwanted reflections that can impair the system's performance. Our welded terminations form a molecular bond between the wire and our contact. There is also no added capacitance from the use of solder, and our weld monitors provide manufacturing SPC. Meritec's creative design minimizes the strip length of the wire at the termination point to maintain the cleanest impedance environment throughout. When you add it all up, the HPM-5 assembly provides the best and most consistent combination of low loss, cross-talk, skew, capacitance and controlled impedance.
The HPM-5 cable assemblies are fully compatible with backplane systems that are IEC 1076-4-101 and IEC 917 compliant, such as FCI Millipacs 2 ™, AMP Z-Pack and other Futurebus+ and Compact PCI products. In addition, Meritec offers shielded backshells for EMI applications.
Meritec, A Division of Associated Enterprises, 1359 West Jackson Street, Painesville, OH 44077. Tel: 440-354-3148; Fax: 440-354-0509.