Multi-Chip-Module
Source: Valtronic USA, Inc
Valtronic is one of the pioneers of the MCM-BGA packaging concept
Valtronic is one of the pioneers of the MCM-BGA packaging concept, developing a proprietary MCZM-BGA (Multi-ChipCarrier-Module) technique in 1992. In the last several years Valtronic has shipped millions of these modules.
Valtronic's BGA type MCZM package provides a method of mounting two or more unpackaged ICs onto a carrier substrate. The MC2M-BGA is then soldered directly to a PC board as a common Surface Mount Device (SMD) via solder bumps. This process eliminates the need for costly IIO pins previously required on standard MCM packages.
The MCZM-BGA is recommended when the designer is seeking a specific function that is not yet available in a standard component.
Valtronic USA, Inc, 6168, Cochran Road, Solon, OH 44139. Tel: 440-349-1239; Fax: 440-349-1040.