New High Bond Strength Thermal Interface Material

MH&W International has introduced KoolBond™ material for providing a thermally conductive interface while firmly attaching heat sinks to hot PCB components:

• KoolBond interface material consists of a fine woven, nickel-coated copper fiber matrix with a high-strength pressure sensitive adhesive (PSA) on the outside. The woven copper closely conforms to irregular mounting surfaces on components and heat sinks to enhance thermal transfer and cooling performance.
• Thermal impedance of KoolBond is 0.42°Kin2/W in material thickness of 5 mils, and 0.74º Kin²/W at 10 mil thickness.
• KoolBond material's double-sided PSA provides a high strength bond that eliminates the costs of screws, clips, or other hardware for mounting sinks to IC's, transistors, mosfets, op amps, and other hot-running circuit board components. A 10-mil thick KoolBond pad provides lap shear strength of 35.5 N/cm².
• The material's adhesive surfaces are protected by release liners for fast, peel and stick application to speed assembly.
• Both 5- and 10-mil thick KoolBond interface material is available in sheets and custom die-cut shapes. The material can also be laser cut.

SOURCE: MH&W International