DATEL maintains multiple manufacturing and assembly technologies including thick and thin-film hybrid, SMT on ceramic, SMT on pcb, and traditonal through-hole pcb. We also have direct access to custom CMOS and bipolar monolithic technologies.
As a result of recent large investments in capital equipment, we now possess one of the most modern, fully automated, pick-and-place SMT assembly operations in our industry. We also have made significant investments in a new MES system and complete, in-house, quality/reliability and EMI/EMC testing facilities.
DATEL operates under the umbrella of a Company-wide, continuous-improvement program. We exploit SPC, JIT, and MRPII manufacturing controls. We are ISO-9001 registered and our thick and thin-film hybrid facilities are qualified to MIL-STD-1772. Virtually all our products endure a comprehensive, in-house qualification procedure, including HALT, before being introduced for sale.