RF Test Socket
The RF test socket provides a built-in spring-loaded heatsink to prevent deformation of device leads during testing cycles
N/A socket provides a built-in spring-loaded heatsink to prevent deformation of device leads during testing cycles. The socket is designed for use with QFP, LCC and SO devices. The socket's heatsink is constructed from copper or aluminum, with gold or silver plating. The spring-loading give compliance to the heatsink, ensuring that it maintains constant contact with the device's heat pad. The entire socket assembly is pressure-mounted to the load board. The heatsink can be coupled with either pogo pins for better electrical contact, or a thermocouple for direct thermal monitoring of the test package. Both the pogos and the thermocouple will contact the test device's underside metal pad. The RF socket incorporates Microstrip Contacts, which have less than one dB loss @ 10 GHz, with no more than 0.01 nH measured self-inductance.
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