Thick Film Substrate Fabrication

The ability to integrate passive components into the substrate (capacitors, resistors, inductors) allows for high density, high performance assemblies that operate at high temperatures (above 120C), high frequencies (up to 40Ghz), very small size (up to 3000 I/O/square inch density), and high volume (millions of circuits per month).

Thick film and ceramic substrates offer excellent value for high performance/high miniaturization circuitry. It is used extensively by the market leaders in wireless, automotive, medical, broadband communications, and test instrumentation electronics. High performance thick film is not as widely standardized as SMT on FR4, but Hytel Group has extensive experience helping customers apply this technology to their applications. Due to the custom nature of thick film, the technology is most cost effective (often equal or lower in cost to PCB assemblies) at higher volumes (tens of thousands of units and up). Hytel Group has experience with numerous ceramic materials and metallizations, as well as full automation throughout the operation.

Hytel Group Inc., 290 Industrial Drive, Hampshire, IL 60140. Tel: 847-683-5331; Fax: 847-683-7940.