Business Wire

  1. ABLIC Inc. Launches The S-85M0A Series Of Ultra-High Efficiency Step-Down Switching Regulators In The Industry's Most Compact(*) Size
    8/20/2018

    ABLIC Inc., a semiconductor manufacturer, recently launched the S-85M0A Series of ultra-high efficiency step-down switching regulators for wearable and IoT devices

  2. Comtech Telecommunications Corp. Awarded $1.0M Order For Solid-State High-Power Amplifiers For Military Customers
    8/16/2018

    Comtech Telecommunications Corp. announced recently that during its fourth quarter of fiscal 2018, its Santa Clara, California-based subsidiary, Comtech Xicom Technology Inc., which is part of Comtech's Commercial Solutions segment, was awarded a $1.0M order to supply solid-state high-power amplifiers to a military integrator

  3. Cadence Palladium Z1 Enterprise Emulation Platform Enables GUC To Accelerate SoC Design
    8/14/2018

    Cadence Design Systems, Inc. recently announced that Global Unichip Corporation (GUC) has adopted the Cadence Palladium Z1 Enterprise Emulation Platform to accelerate system-on-chip (SoC) design and drive innovation in the semiconductor industry

  4. Power Integrations Announces Successful Certifications Of USB PD Adapters Using InnoSwitch3 ICs
    8/9/2018

    Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, recently announced that a range of adapter designs based on Power Integrations’ InnoSwitch 3-Pro and InnoSwitch3-CP ICs have achieved compliance with USB Power Delivery (PD) 3.0 standards

  5. CyberOptics Demonstrates Industry-Leading Airborne Particle And Ultra High-Resolution MRS Sensors At SEMICON Taiwan
    8/9/2018

    CyberOptics Corporation, a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces it will demonstrate its next generation Airborne Particle Sensor technology (APS3) 300mm with new ParticleSpectrum software at SEMICON Taiwan, September 5-7 at the Nangang Exhibition Center in Taipei in booth #L312

  6. THine Releases 4x10Gbps CML Redriver For 2x4K XR Active Cable
    8/7/2018

    THine Electronics, Inc., the global leader in high-speed serial interface and provider of mixed-signal LSI, recently announces that THine has released 4x10Gbps CML redriver product, THCX422R10, for 2x4K XR(AR/VR/MR) active cable solutions

  7. Toshiba Develops 40V N-channel Power MOSFETs With Improved Thermal Performance
    7/31/2018

    In August, Toshiba Electronic Devices & Storage Corporation (“Toshiba”) will start mass production and shipments of “TPWR7904PB” and “TPW1R104PB”, 40V N-channel power MOSFETs for automotive applications

  8. Simplify The Driving Of Low-Power Lighting With Automotive LED Drivers From Diodes Incorporated
    7/26/2018

    Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets, recently extends its family of automotive LED drivers with the BCR4xxUQ series that simplifies the driving of low-power lighting

  9. AKM Has Developed Ultra-Low Power Step-Up DC-DC Converter In Sensing Technology
    7/23/2018

    Asahi Kasei Microdevices Corporation (AKM) has developed a step-up DC-DC converter that works only consuming 3μW of power

  10. Cadence Introduces Voltus-XP Technology With Extensive Parallelism, Up To 5X Acceleration, And Increased Capacity For Power Signoff At Advanced Nodes
    7/23/2018

    Cadence Design Systems, Inc. recently announced that it has enhanced the Cadence Voltus IC Power Integrity Solution with an extensively parallel (XP) algorithm option employing distributed processing technology for power grid signoff at advanced-node process technologies