Business Wire
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Teledyne HiRel Semiconductors Releases Wideband 50 GHz RF Switch
2/4/2025
Teledyne HiRel Semiconductors announces the availability of its latest rad-tolerant wideband 50 GHz RF switch, model TDSW050A2T.
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Advanced Chip And Circuit Materials Introduces CeleritasSF & CeleritasBU Products For Ultra-High-Speed, Buildup, And UHDI Printed Circuit Boards
1/24/2025
Advanced Chip and Circuit Materials Inc. (ACCM), a US-based manufacturer of skew free, ultra-thin copper-clad laminates and dielectric prepreg materials used to fabricate high layer count PTH, Buildup and UHDI multilayer printed circuit boards (PCBs), today announced the introduction of the CeleritasSF and CeleritasBU series of laminates and prepregs, which enable PCIe Gen 6 & 7 and data rates of 224 Gb/s per channel.
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Guerrilla RF Unveils New Gallium Nitride (GaN) Dice For High-Performance RF Applications
1/16/2025
Guerrilla RF, Inc. announces the formal release of the GRF0020D and GRF0030D, the first in a new class of GaN on SiC HEMT power amplifiers being developed by the company.
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Renesas Introduces New MOSFETs With Exceptional Performance
1/9/2025
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced new 100V high-power N-Channel MOSFETs that deliver industry-leading high-current switching performance for applications such as motor control, battery management systems, power management and charging.
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Teledyne HiRel Semiconductors Releases High-Power RF GaN Switch (30 MHz to 5 GHz)
1/9/2025
Teledyne HiRel Semiconductors announces the availability of its Gallium Nitride (GaN) high-power RF switch, model TDSW84230EP.
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Murata Develops The World's Smallest Class 006003-Inch Size (0.16 mm x 0.08 mm) Chip Inductor
1/6/2025
Murata Manufacturing Co., Ltd. announces the development of the world’s smallest class 006003-inch size (0.16 mm x 0.08 mm) chip inductor, which will be unveiled during CES 2025, January 7-10, Las Vegas, USA (Murata Booth: Las Vegas Convention Center, West Hall Booth #6500).
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Mitsubishi Electric To Ship Samples Of S1-Series HVIGBT Module
12/22/2024
Mitsubishi Electric Corporation announced today that it will begin shipping samples of two new S1-Series High Voltage Insulated Gate Bipolar Transistor (HVIGBT) modules, both rated at 1.7kV, for large industrial equipment such as railcars and DC power transmitters from December 26.
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MACOM's 500W GaN-On-Si Power Transistor For L-Band ASR Applications
10/10/2017
MACOM Technology Solutions Inc. (“MACOM”) recently announced the newest entry in its GaN-on-Si power transistor portfolio for pulsed L-Band radar systems targeted for airport surveillance radar (ASR) applications at 1.2 to 1.4 GHz.
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New IPM Solution For Embedded Drive Applications
5/19/2015
Vincotech, a supplier of module-based solutions for power electronics, recently announced the release of a new intelligent-power module (IPM) for low-power operation in embedded drive applications
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Convergent Industrial Applications Profit From Widespread Adoption Of Analog Devices Processors
11/11/2008
The industry’s broadest portfolio of embedded and signal processing choices is what increasingly attracts industrial application developers to technologies from Analog Devices, Inc.