Latest Headlines

1. Artilux Announces Inception™: A Hybrid Optoelectronic Architecture For The Next-Generation AI Computing 4/15/2026

   Artilux today announced Inception™, an AI computing paradigm shift from conventional digital electronics to novel hybrid optoelectronics, delivering orders-of-magnitude improvements in both power and area efficiencies without relying on advanced CMOS process nodes and active cooling.

2. TDK Enables Compact 1250 V DC Converter Designs With A New High-Voltage Common-Mode Choke 4/15/2026

   TDK Corporation presents the B82722V6*B040 series of new compact high-voltage, current-compensated ring-core double chokes. Designed primarily for rated DC voltages of up to 1250 V (630 V AC), these compact common-mode chokes (23 x 15.5 x 24 mm) effectively suppress EMI in next-generation applications.

3. Microchip Expands dsPIC33A DSC Family For High-Density AI Data Center Power, Complex Motor Control And Intelligent Sensing 4/14/2026

   As AI servers, data centers, automotive and industrial systems demand higher efficiency designs, deterministic real-time control and quantum-resistant cryptography, Microchip Technology Inc. (Nasdaq: MCHP) has added dsPIC33AK256MPS306 Digital Signal Controllers (DSCs) to its dsPIC33A DSC family.

4. Applied Materials Introduces Deposition Systems For Angstrom-Era Logic Chips 4/8/2026

   Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today introduced two chipmaking systems designed to create the smallest features in the world’s most advanced logic chips.

5. Murata Begins Mass Production Of Seven Automotive MLCCs With World-Leading Capacitance For Their Rated Voltage And Size 4/8/2026

   Murata Manufacturing Co., Ltd has begun mass production of seven AEC-Q200-qualified multilayer ceramic capacitors (MLCCs) that achieve the world’s largest capacitance for a given rated voltage and size^*, supporting stable operation of in-vehicle systems and greater design flexibility.

6. Teledyne Labtech Accelerates Prototype And Early‑Programme PCB Builds With New Rapid Quote‑To‑Manufacture Service 4/8/2026

   Teledyne Labtech, a leader in microwave circuit design, component manufacturing and testing, has introduced a new Rapid Quote‑to‑Manufacture service that shortens the path from quotation to delivered prototype PCBs for early-stage RF and microwave programmes.

7. Vishay Intertechnology Automotive Grade Photovoltaic MOSFET Driver Boosts Reliability And Lowers Costs In High Voltage Systems 4/1/2026

   Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new Automotive Grade photovoltaic MOSFET driver that is the first such device in the compact SMD-4 package to provide a creepage distance of 8 mm and mold compound with a comparative tracking index (CTI) of 600.

8. MaxLinear Expands MxL8323x RS 485/RS-422 Transceiver Family With Up To 50Mbps Performance For Harsh Industrial Environments 3/26/2026

   MaxLinear, Inc. today announced an expansion of its industrial connectivity portfolio with the MxL8323x family of RS-485 / RS-422 half-duplex transceivers, designed to deliver scalable data rates up to 50Mbps, robust ESD and EFT protection, and wide voltage compatibility for electrically harsh industrial applications.

9. Wonderful PCB Launches Advanced PCB Reverse Engineering And Cloning Services To Accelerate Electronics Innovation 3/25/2026

   Wonderful PCB, a leading provider of PCB manufacturing and assembly services, today announced the expansion of its PCB reverse engineering and PCB cloning services, designed to help global electronics manufacturers quickly rebuild design data from existing circuit boards and bring products to market faster.

10. Pacific Defense Launches Next-Generation AI-Enabled Digital Signal Processor For Next-Generation Mission Systems 3/25/2026

    Pacific Defense today announced the launch of the DSP3100VP, a next-generation digital signal processing module engineered to bring advanced artificial intelligence and machine learning (AI/ML) capabilities to the edge.