Latest Headlines

  1. TE Connectivity Announces 3-In-2 Memory Card Connectors

    TE Connectivity (TE), a world leader in connectivity and sensors, recently announced its 3-in-2 card connector, an ideal solution for enabling SIM and micro SD card connectivity in mobile phones, tablets, ultraportable devices and personal computers

  2. Digital Power Corporation Announces The Release Of Higher Power Additions To Its Capacitor Charger Product Family

    Digital Power Corporation (NYSE MKT:DPW) announced the release of high power additions to its family of advanced capacitor charger products

  3. Silicon Valley-Based Foundry Noel Technologies Expands Facility And Adds New Wafer-Processing Capabilities

    Noel Technologies, a specialty semiconductor foundry performing process development and substrate fabrication for a variety of high-technology industries, has expanded its wafer-fabrication facility in Silicon Valley by adding square footage and installing additional equipment that boost its production capacity by 25 percent

  4. Diodes Incorporated’s Power Switcher With HV Transistor Improves Efficiency Of Line-Powered Chargers

    Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets, recently introduced the AP3984 high-performance power switcher

  5. Navitas Produces World’s First Integrated Half-Bridge GaN Power IC

    Navitas Semiconductor today announced a major technology breakthrough with the introduction of the industry’s first integrated half-bridge Gallium Nitride (GaN) Power IC

  6. MaxLinear Launches High-Performance 32Gbaud Linear Coherent Transimpedance Amplifier (TIA) For 100Gbps/200Gbps Long-Haul And Metro Networks

    MaxLinear Inc., a leading provider of radio frequency (RF) and mixed-signal integrated circuits for cable and satellite broadband communications, the connected home, data center, metro, long-haul fiber networks, and wireless infrastructure, recently introduces the MxL9105, a dual-channel linear coherent transimpedance amplifier (TIA) for 100Gbps/200Gbps dense wave division multiplexing (DWDM) coherent systems.

  7. Molex Introduces Impact zX2 Backplane Connector System To Meet High-Speed Application Demands

    Molex has released the Impact zX2 Backplane Connector System, featuring industry-leading density and signal integrity (SI) performance, while supporting data rates of up to 28 Gbps in a modular design

  8. Intersil Announces Industry's Smallest Isolated RS-485 Transceiver

    Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions, today announced the industry's smallest isolated RS-485 differential bus transceiver designed to provide 4Mbps bidirectional data transmission for Industrial Internet of Things (IIoT) networks

  9. TI Unveils Industry's Smallest 12-V, 10-A DC/DC Step-Down Power Solution

    Texas Instruments (TI) (NASDAQ: TXN) today introduced a pair of 12-V, 10-A, 4-MHz step-down power modules that provide a power management solution that is 20 percent smaller than any other 10-A power module-based solution available today

  10. Vishay Intertechnology Extends Capacitance Range Of MIL-PRF-39006/33-Qualified Wet Tantalum Capacitor

    Vishay Intertechnology, Inc. (NYSE:VSH) today announced that it has expanded the capacitance range of its M39006/33 (Style CLR93) tantalum-cased, hermetically sealed wet tantalum capacitor