Latest Headlines

  1. ASE And Cadence Deliver First System-In-Package EDA Solution Tailored For ASE’s High-Performance, Advanced IC Package Technologies

    Advanced Semiconductor Engineering, Inc., and Cadence Design Systems, Inc., recently announced they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages 

  2. Toshiba Introduces SOI Process For Low-Noise RF Amplifiers For Smartphones

    Toshiba Electronic Devices & Storage Corporation recently announced the development of “TaRF10,” a next generation TarfSOI (Toshiba advanced RF SOI) process optimized for low-noise amplifiers (LNAs) in smartphone applications. 

  3. Fairview Microwave's New High-Speed Millimeter-Wave End Launch Connectors

    Fairview Microwave Inc., a supplier of on-demand microwave and RF components, has released a new line of high-speed end launch connectors. They are ideal for signal integrity measurements, chip evaluations, coplanar waveguide, 25 GbE, SERDES, substrate characterization and test fixture applications.

  4. Molex Spotlights High-Speed Data Connectivity And Expertise At DesignCon 2018

    Molex, a global provider of integrated electronic products, will showcase high-speed data connectivity solutions at DesignCon 2018 in Santa Clara, CA, January 31-February 1, 2018

  5. New Vishay Intertechnology Noise Suppressor Resistors Offer Increased Voltage Performance And Reliability

    Vishay Intertechnology, Inc. (NYSE:VSH) today introduced a new series of wirewound noise suppressor resistors that delivers improved voltage performance and reliability for automotive ignition systems in reciprocating engines

  6. Pasternack's New Line Of Compact Waveguide Gunn Diode Oscillators

    Pasternack, a leading provider of RF, microwave and millimeter wave products, has unveiled a new line of compact waveguide Gunn diode oscillators that are tunable and generate signal levels that exhibit low phase noise at popular K and Ka band frequencies.

  7. AgigA Tech Introduces New Family Of PowerGEM Energy Modules For NVDIMM Backup Power

    AgigA Tech, Inc., a leading provider of high-speed, high-density, battery-free non-volatile memory solutions and a subsidiary of Cypress Semiconductor Corp., recently announced the availability of its new family of PowerGEM Green Energy Modules

  8. AVX Releases New High-Value Resistors

    AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, has released the new HR Series high-value resistors

  9. ADI 72V Hybrid Step-Down DC/DC Controller Reduces Solution Size By 50% Compared To Traditional Architectures

    Analog Devices, Inc. recently announced the Power by Linear LTC7821, an industry first hybrid step-down synchronous controller that merges a switched capacitor circuit with a synchronous step-down controller, enabling up to a 50% reduction in DC/DC converter solution size compared to traditional step-down solutions

  10. MagnaChip Offers Multi-Level Thick IMD Process For Capacitor With Ultra-High Breakdown Voltage

    MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced it now offers a multi-level thick IMD (Inter-Metal Dielectric) process for a capacitor with ultra-high breakdown voltage