Downloads
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Low Height Thin-Fin Forged Aluminum Heat Sinks: APF Series
2/13/2013
The APF Series Heat Sinks feature low profile thin fins, improved thermal performance over conventional heat sinks, multiple fin heights, precision forging technology for high power applications, and more. This series is designed for BGA and other surface mount ICs (integrated circuits).
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Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series
2/13/2013
The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.
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7-Way Space Qualified Power Divider: DL7700 Datasheet
2/12/2013
The DL7700 7-Way Space Qualified Power Divider features low VSWR, high isolation, and compact, drop-in packaging. It covers the 620-820 MHz frequency range and is ideal for aerospace, avionics, military/defense, and SATCOM applications. Download the datasheet for its specifications.
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7-Way Space Qualified Power Divider
2/12/2013
This space qualified power divider operates in the 620-820 MHz frequency range and uses a combination of ferrite and microstrip technologies in a hermetically sealed flatpack.
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1.7 µm InGaAs/InP Epitaxial Wafers for 1D: 2D Sensors
1/17/2013
To comply with increasing demands for higher transmission rates and longer wavelength components, Marktech is now producing high reliability wafers on 4" substrates utilizing sophisticated manufacturing processes in Epitaxial InP thin film growth. GaAs and SiGe based components are known to have limitations in speed. InP platform based devices are capable of exceeding these transmission rate limitations, including the operating margin.
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Thermal Power Testing Methodology for Chip, Flange, and PCB-Mounted Resistors
1/14/2013
Resistors can be used to dissipate excess power, act as a system’s safety mechanism, provide a matching device, and more. Resistors convert electrical energy into heat energy through the use of a resistive element. They’re usually mounted to a heatsink, a flange, or directly on a PCB.
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Recommended Soldering Techniques for SMD, Chip, Flangeless, and Flanged Resistors
1/14/2013
This application note provides recommendations for attached Anaren’s SMD, chip, flangeless, and flanged resistive products. A good solder joint can be critical in achieving a chip’s maximum performance. Mounting considerations for each different type are included with accompanying figures for visual aids. All Anaren resistives have a matte tin outside finish to achieve good solderability and RoHS compliance.
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Power Handling Considerations for SMD Terminations, Attenuators, and Resistors
1/14/2013
Power ratings for Anaren’s SMD Terminations, Attenuators, and Resistors are based off of the temperature at the solder interface where the solder is in contact with the SMD components. This application note describes the power rating of high power surface mount resistive products.
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Non-Reflective SP6T RF Switch: SWA-6200-500S Datasheet
12/18/2012
This Non-Reflective SP6T RF Switch operates in the 100 to 1000 MHz frequency range, has a 1.5dB (max) insertion loss, and 50 Ohms impedance. Its two most notable features, however, is that it requires only a positive supply of 10-15 volts, and the fact that it’s RS-422 controlled (most pin diode switches are TTL logic controlled). Download the datasheet for additional information on electrical, mechanical, and environmental specifications for this RF switch.
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Quadrature Hybrids Selection Guide
12/11/2012
Quadrature hybrids are four-port directional couplers with a -3dB coupling coefficient. TRM Microwave offers high-reliability, space qualified 90° and 180° quadrature hybrids along with standard models for land, air and sea based military architectures. To find out more about quadrature hybrids and their advantages over traditional power dividers, please download the selection guide.