Downloads

31. Heat Sinks with Low Thermal Resistance 2/13/2013

    Heat sinks are used for the dissipation of heat from high performance integrated circuits (ICs). Two different series are featured here; the forged heat sink series, and the extruded heat sink series. These heat sinks feature excellent thermal performance and are applicable to BGA, PGA, PLCC, QFP, and other IC packages.

32. Forged Aluminum Heat Sinks with Plate Fins: AER Series 2/13/2013

    The AER Series of forged heat aluminum heat sinks features precision forging technology for high power applications. Multiple fin heights and various mounting methods are available. This series is designed for BGA and other surface mount ICs (integrated circuits).

33. Forged Aluminum Heat Sinks with Pin Fins: APR Series 2/13/2013

    The APR Series of forged heat aluminum heat sinks features omni-directional pins, precision forging technology for high power applications, multiple pin heights, and much more. This series is designed for BGA and other surface mount ICs (integrated circuits).

34. Low Height Thin-Fin Forged Aluminum Heat Sinks: APF Series 2/13/2013

    The APF Series Heat Sinks feature low profile thin fins, improved thermal performance over conventional heat sinks, multiple fin heights, precision forging technology for high power applications, and more. This series is designed for BGA and other surface mount ICs (integrated circuits).

35. Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series 2/13/2013

    The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100^oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.

36. 1.7 µm InGaAs/InP Epitaxial Wafers for 1D: 2D Sensors 1/17/2013

    To comply with increasing demands for higher transmission rates and longer wavelength components, Marktech is now producing high reliability wafers on 4" substrates utilizing sophisticated manufacturing processes in Epitaxial InP thin film growth. GaAs and SiGe based components are known to have limitations in speed. InP platform based devices are capable of exceeding these transmission rate limitations, including the operating margin.

37. Thermal Power Testing Methodology for Chip, Flange, and PCB-Mounted Resistors 1/14/2013

    Resistors can be used to dissipate excess power, act as a system’s safety mechanism, provide a matching device, and more. Resistors convert electrical energy into heat energy through the use of a resistive element. They’re usually mounted to a heatsink, a flange, or directly on a PCB.

38. Test Essentials™ for Precision and Lab Adapters 11/19/2012

    This download provides in depth information on Maury Microwave’s Test Essentials^TM advantage. This process results in lab and precision adapters with outstanding design, precision construction, and that have been subjected to rigorous testing. Charts highlighting individual models of the adapter line are included as well.

39. Resistor Products Short Form Catalog 11/12/2012

    This brochure contains information on CTS Electronic Components’ line of short form resistors. These products are ideal for LVD SCSI, DDR SDRAM, Compact PCI, IDE, DRAM, SDRAM, GTL, PCI, LVPECL, VME, and FPGAL/LVDS applications.

40. High Performance Radio Module: A2530R24x User Manual 11/6/2012

    This series of high performance radio modules feature a wide input voltage range, excellent receiver sensitivity and robustness to interference, and more. This manual contains an overview of the radio module, and includes information on its features, operation theory, product approvals, potential interface sources, and much more.