Latest Headlines

  1. USB-To-I2S Bridge Chip Brings Turnkey Simplicity To Digital Audio Design

    Silicon Labs (NASDAQ: SLAB) has introduced a fixed-function audio bridge device that provides a simple, turnkey solution for transferring digital audio data between the universal serial bus (USB) and integrated inter-IC sound (I2S) serial bus interfaces

  2. Carbide 3D Announces The Launch Of Carbide Copper

    Carbide 3D, manufacturer of desktop CNC machines, announces the launch of Carbide Copper, software to make printed circuit boards on their Nomad CNC machines

  3. Microscan Launches Trade-Up Program For Barcode Verifiers In The Americas Region

     Microscan, a global leader in barcode, machine vision, verification, and lighting technology, has launched a trade-up program for its LVS-9510, LVS-9570, and LVS-9580 verifiers in the Americas Region (North America, Central America, and South America). Any ISO, AIM, or GS1-compliant verifier in good working order is eligible for this trade-up program. The program takes place from April 10th to August 31st, 2017.

  4. ProTek Devices’ Steering Diode TVS Array Combo Component Protects Circuits In Consumer And Networking Electronics Interfaces

    ProTek Devices™ has introduced the PLR0502-6, an ultra-low capacitance (0.7pF typical) steering diode and transient voltage suppressor array (TVS array) combination component

  5. TDK CeraLink™ Ceramic Capacitors Now Available With Higher Rated Voltage

    TDK Corporation today announced that it has expanded the company's CeraLink™ series of ceramic capacitors with two new low-profile (LP) types designed for a rated voltage of 900 V DC

  6. MPS Launched 180V, 16-Channel, Analog Switch Multiplexer For Ultrasound Applications That Requires No High-Voltage Supplies

    Monolithic Power Systems, Inc. (MPS) (Nasdaq: MPWR), a leading company in high-performance analog solutions, today announced its launch of two new high-voltage analog switch ICs, the MP4816A and MP4816, for medical ultrasound imaging applications

  7. MagnaChip Unveils New 0.18 Micron RFSOI 2.5V Process With Enhanced Switching Performance

    MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers a new 0.18 micron RFSOI process with enhanced switching performance.

  8. A SOI Wafer Is A Suitable Substrate For Gallium Nitride Crystals

    In cooperation with Okmetic Oy and the Polish ITME, researchers at Aalto University have studied the application of SOI (Silicon On Insulator) wafers, which are used as a platform for manufacturing different microelectronics components, as a substrate for producing gallium nitride crystals.

  9. Digital Power Corporation Announces The Release Of Higher Power Additions To Its Capacitor Charger Product Family

    Digital Power Corporation (NYSE MKT:DPW) announced the release of high power additions to its family of advanced capacitor charger products

  10. Navitas Produces World’s First Integrated Half-Bridge GaN Power IC

    Navitas Semiconductor today announced a major technology breakthrough with the introduction of the industry’s first integrated half-bridge Gallium Nitride (GaN) Power IC