Latest Headlines
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0-20V To 0-1500V Programmable Power Supplies Can Be Configured In 20U High 19"Racking Cabinets To Deliver 90kW
7/9/2024
TDK Corporation (TSE 6762) announces the introduction of 90kW rated GSPS 20U 19-inch racking cabinets to the TDK-Lambda GENESYS+ series of programmable DC power supplies.
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EMC Components: TDK Offers Common Mode Filter For Automotive Ethernet 10BASE-T1S
7/9/2024
TDK Corporation announces that it has expanded its lineup of the ACT1210E Series (3.2 x 2.5 x 2.5 mm - L x W x T) of common mode filters for automotive Ethernet communication 10BASE-T1S.
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Key Electronic Device Developed For The Massive Arrival Of 6G Networks
7/9/2024
UAB researchers were involved in the development of a switch, an essential device in telecommunications, capable of operating at very high frequency with lower power consumption than conventional technologies.
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HMI Introduces Quad-Channel 50 mΩ High-Side Switch For Advanced Automotive Applications
7/9/2024
HMI, a leading provider of advanced analog and power management technologies, today announced the launch of its HL8545 and HL8545G, advanced quad-channel, high-side switches designed to meet the demanding requirements of today's automotive systems.
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New Waterproof Poke-Home Connectors
6/26/2024
The new 9289-000 Series single-piece wire-to-wire connectors facilitate quick, easy, accurate, economical, and space-saving high-reliability, IP67 in-field connections in a variety of industrial, transportation, commercial, and consumer electronics applications.
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New Vishay Intertechnology Gen 3 1200 V SiC Schottky Diodes Increase Efficiency And Reliability For Switching Power Designs
6/26/2024
Vishay Intertechnology, Inc. (NYSE: VSH) today introduced 16 new Gen 3 1200 V silicon carbide (SiC) Schottky diodes. Featuring a merged PIN Schottky (MPS) design, the Vishay Semiconductors devices combine high surge current robustness with low forward voltage drop, capacitive charge, and reverse leakage current to increase efficiency and reliability in switching power designs.
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Neoconix Unveils Our SPH & CBM 112G High-Speed Link
6/25/2024
Neoconix today announced immediate availability of the ultra-dense C-Beam "Mini" (CBM) and SPH3 "Ultra" board to board array connectors enabled by C-Beam™ technology. Capable of supporting 112Gbps data rates with offered pitches of 0.5mm and 0.6mm.
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Xpeedic Releases EDA 2024 Platforms To Accelerate Designs, Simulations Of Next-Generation High-Frequency, High-Speed Electronic Products
6/24/2024
Xpeedic today released the EDA 2024 edition of its platforms with significant upgrades in solver engines and features across all advanced packaging, high-speed system, RF system and multi-physics simulation fields during the 61st Design Automation Conference (DAC).
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KYOCERA AVX Launches New Wire-To-Board Card-Edge Connectors Equipped With Two Solderless Contact Technologies
6/19/2024
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, launched the new 9169-000 Series single-piece wire-to-board card-edge connectors.
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Hoymiles Announces The World's First Super 5000 W Microinverter That Promises Unparalleled Longevity
6/12/2024
Hoymiles, a world-leading power electronics company well-versed in PV and energy storage and specializing in microinverters, has launched an 8-in-1 super microinverter designed for industrial, commercial, and large residential projects.