Latest Headlines
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KYOCERA AVX Releases Revolutionary, Award-Winning Ultra-Wideband LDS Tulip Antenna To Market
10/8/2024
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the innovative new surface-mount, on-ground, ultra-wideband (UWB) LDS Tulip antenna (9002305L0-L01K) for 6.0–8.5GHz applications to market at Embedded World North America today.
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ROHM's New PWM Controller ICs With SOP Package For Power Supplies In A Wide Variety Of Industrial Applications
10/8/2024
ROHM Semiconductor today announced new external FET-type controller ICs utilizing PWM current control mode optimized for AC-DC power supplies in various industrial applications.
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New Revolutionary, Award-Winning Ultra-Wideband LDS Tulip Antenna
10/7/2024
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the innovative new surface-mount, on-ground, ultra-wideband (UWB) LDS Tulip antenna (9002305L0-L01K) for 6.0–8.5GHz applications to market at Embedded World North America today.
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Modelithics And Signal Edge Solutions Forge Strategic Partnership To Advance Signal Integrity And Power Integrity Modeling
10/7/2024
Modelithics, the industry leader in RF and microwave modeling, and Signal Edge Solutions (SES), a cutting-edge provider of simulation, modeling, and measurement solutions, have joined forces in a strategic partnership aimed at advancing signal integrity and power integrity modeling.
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HSE Scientists Have Developed A New Model Of Electric Double Layer
9/30/2024
This new model accounts for a wide range of ion-electrode interactions and predicts a device's ability to store electric charge. The model's theoretical predictions align with the experimental results. Data on the behaviour of the electric double layer (EDL) can aid in the development of more efficient supercapacitors for portable electronics and electric vehicles.
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Reliable Ultra-Fine Pitch 0.40 mm Printed Circuit Board (PCB) Connectors With 28 Gbps NRZ Performance Now Available
9/26/2024
Samtec announces immediate availability of its SS4/ST4 Series ultra micro printed circuit board (PCB) connectors that offer an ultra-fine 0.40 mm pitch, enabling maximum signal density at 28 Gbps NRZ performance.
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Quantic Electronics And Richardson Electronics Forge Global Technology Partnership
9/18/2024
Quantic® Electronics ("Quantic"), a portfolio company of Arcline Investment Management, today announced a global distribution agreement with Richardson Electronics, Ltd. (NASDAQ: RELL), a global leader in engineered solutions.
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Mercury Introduces New Small Form Factor Digital Signal Processing Module Powered By Altera Agilex FPGAs
9/16/2024
Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a technology company that delivers mission-critical processing power to the edge, today announced the expansion of its portfolio of Direct RF digital signal processing products that use Altera™ Agilex FPGAs to detect and process emissions from a wide portion of the electromagnetic spectrum.
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Nexperia Now Offers Automotive Qualified Small-Signal MOSFETs In Tiny DFN1110D-3 And DFN1412-6 Packages
9/10/2024
Nexperia today announced the release of single and dual small-signal MOSFETs in miniature DFN packages. The automotive qualified devices are available in DFN1110D-3 and DFN1412-6 respectively.
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Infineon Announces StrongIRFET 2 Power MOSFET 30 V Portfolio For Mass Market Applications
9/10/2024
Infineon Technologies AG is introduced its new StrongIRFET 2 power MOSFET 30 V portfolio, expanding the existing StrongIRFET 2 family to address the growing demand for 30 V solutions in the mass market segment.