Latest Headlines
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ATP Electronics Launches Industrial 176-Layer PCIe Gen 4 x4 M.2, U.2 SSDs Offering Excellent R/W Performance, 7.68 TB Highest Capacity
6/28/2023
ATP Electronics, the global leader in specialized storage and memory solutions, introduces its latest high-speed N600 Series M.2 2280 and U.2 solid state drives (SSDs) sporting the 4th generation PCIe® interface and supporting the NVMe™ protocol.
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Intlvac Thin Film Solutions For Integrated Circuit Analysis
6/16/2023
Intlvac Thin Film, a Canadian advanced manufacturing company that has a thirty-year history in the thin film deposition and materials science industry with clients in the aerospace & defence, medicine, telecommunications, energy, hydrogen fuel cells, optics and photonics industries is now expanding its global customer base with its Nanoquest product lines that are used to delayer and analyse integrated circuits.
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Crocus Technology Unveils CT40x, Expands Its Industry-Leading Portfolio Of XtremeSense® TMR Magnetic Sensors With The Best Performance-To-Cost Balance
6/13/2023
Crocus Technology, the leader in TMR magnetic sensor technology, is thrilled to unveil the CT40x, a new industry standard for current sensing solutions that enables an outstanding balance of performance and cost without compromise.
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Vishay Intertechnology Thick Film Power Resistor With Optional NTC Thermistor And PC-TIM Simplifies Designs, Saves Board Space, And Lowers Costs
5/30/2023
Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new AEC-Q200 qualified thick film power resistor in the compact, low profile SOT-227 package for mounting on a heatsink.
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Molex Unveils First-To-Market, Chip-To-Chip 224G Product Portfolio To Accelerate Support For Next-Gen Data Centers & Generative AI Applications
5/23/2023
Molex, a global electronics leader and connectivity innovator, has introduced the industry's first chip-to-chip 224G product portfolio, encompassing next-gen cables, backplanes, board-to-board connectors and near-ASIC connector-to-cable solutions operating at speeds up to 224 Gbps-PAM4.
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NVIDIA, Rolls-Royce and Classiq Announce Quantum Computing Breakthrough For Computational Fluid Dynamics In Jet Engines
5/22/2023
ISC—NVIDIA, Rolls-Royce and Classiq, a quantum software company, today announced a quantum computing breakthrough aimed at bringing ever-increasing efficiency to jet engines.
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Abracon Announces New STM Microprocessor Crystal Reference Tool
5/15/2023
Abracon, a leading provider Frequency Control, Timing, Power, Magnetics, RF and Antenna solutions, has developed and published a brand new STM Microprocessor Crystal Reference Tool to the Abracon website.
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STMicroelectronics Introduces Its Second Generation Of Industry 4.0-Ready Edge AI Powered Microprocessors
5/15/2023
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the second generation of its STM32 MPUs (microprocessors), coming with a new architecture built upon the same ecosystem and raising performance and security for applications at the industrial and IoT edge.
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New Vishay Intertechnology Gen 3 650 V SiC Schottky Diodes Increase
5/10/2023
Vishay Intertechnology, Inc. (NYSE: VSH) today introduced 17 new Gen 3 650 V silicon carbide (SiC) Schottky diodes. Featuring a merged PIN Schottky (MPS) design, the Vishay Semiconductors devices combine high surge current robustness with low forward voltage drop, capacitive charge, and reverse leakage current to increase efficiency and reliability in switching power designs.
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LightSolver All-Laser Technology Poised To Outperform And Outpace Quantum And Classical HPC
5/9/2023
Israeli start-up LightSolver today unveiled the first pure laser-based processing unit (LPU), a new computing paradigm that is poised to outpace and outperform quantum and supercomputers.