Latest Headlines

  1. Interstate Connecting Components (ICC) Announces Value-Added Assembly Of Amphenol Aerospace High-Speed D38999 Series III Connectors 5/15/2025

    Interstate Connecting Components (ICC), a leading distributor of electronic components for the military and aerospace industries, announces expanded support of value-added assembly of Amphenol Aerospace high-speed connectors.

  2. KYOCERA AVX Launches New CP2816 Series High-Directivity Couplers 5/7/2025

    KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new CP2816 Series integrated thin film (ITF) high-directivity couplers for high-frequency wireless systems.

  3. ROHM's Latest 2kV SiC MOSFETs Integrated Into Semikron Danfoss' Module For SMA's Large-Scale Power Conversion System 4/28/2025

    ROHM Semiconductor today announced that SMA Solar Technology AG, a leading global specialist in photovoltaic and storage system technology, has adopted Semikron Danfoss’ Module featuring ROHM’s latest 2kV SiC MOSFETs for its new large-scale power conversion solution “Sunny Central FLEX.”

  4. Ansys Strengthens Collaboration With TSMC On Advanced Node Processes Certification And 3D-IC Multiphysics Design Solutions 4/23/2025

    Through continued collaboration with TSMC,  Ansys today announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions.

  5. Renesas Debuts New Group In Popular RA0 Series With Best-In-Class Power Consumption And Extended Temperature Range 4/22/2025

    Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, today introduced the RA0E2 microcontroller (MCU) Group based on the Arm Cortex-M23 processor.

  6. Microchip Launches High-Reliability BR235 And BR235D Series Of Power Relays For Demanding Military Applications 4/15/2025

    As a leading supplier to the aerospace and defense market, Microchip is committed to providing innovative and robust products that are designed for mission-critical performance in the most demanding environments.

  7. Navitas Announces Automotive Qualification Of High-Power GaNSafe™ ICs 4/15/2025

    Navitas Semiconductor (Nasdaq: NVTS), the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride (GaN) power ICs and silicon carbide (SiC) technology, has announced its high-power GaNSafe™ ICs achieve automotive qualification for both AEC-Q100 and AEC-Q101, showcasing GaN’s next inflection into the automotive market.

  8. Multilayer Ceramic Capacitors: TDK Offers MLCCs With The Industry's Highest Capacitance At 100V For Automotive Applications In 3225 Case Size 4/14/2025

    TDK Corporation has expanded its CGA series for automotive multilayer ceramic capacitors (MLCCs) to 10 µF at 100 V in 3225 size (3.2 x 2.5 x 2.5 mm – L x W x H), with X7R characteristics (Class Ⅱ dielectric).

  9. Adaptive Additive Manufacturing And Volumetric 3D Printing Combined In New APES And Manifest Technologies Partnership 4/8/2025

    Advanced Printed Electronic Solutions (APES) and Manifest Technologies have announced at the RAPID+TCT event in Detroit, Mich., a strategic partnership to integrate volumetric additive manufacturing (AM) into the new Matrix6D high-throughput adaptive AM platform from APES—unlocking a new era of high-speed, support-free 3D printing within a scalable, reconfigurable factory architecture.

  10. Siemens Acquires DownStream Technologies To Expand PCB Design-To-Manufacturing Flow 4/8/2025

    Siemens Digital Industries Software announced today that it has completed the acquisition of DownStream Technologies, a leading provider of manufacturing data preparation solutions for printed circuit board (PCB) design.