Latest Headlines

  1. Renesas Introduces New AnalogPAK Programmable Mixed-Signal ICs, Including First Low-Power Device With 14-Bit SAR ADC 11/12/2024

    Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced new AnalogPAK ICs, including lower power and automotive-qualified devices along with the industry’s first programmable 14-bit SAR ADC (Successive-Approximation Register Analog-Digital Converter).

  2. Fairview Microwave Introduces Surface-Mount Failsafe Electromechanical Relay Switches 11/7/2024

    Fairview Microwave, an Infinite Electronics brand and a leading provider of on-demand RF, microwave and millimeter-wave components, has announced its latest offering: the Quartz Series of surface-mount failsafe electromechanical relay switches.

  3. Vishay Intertechnology Releases New 1 A And 2 A Gen 7 1200 V FRED Pt Hyperfast Rectifiers In eSMP Series SMF (DO-219AB) Package 11/6/2024

    Vishay Intertechnology, Inc. today expanded its Gen 7 platform of 1200 V FRED Pt Hyperfast rectifiers with four new Automotive Grade devices in the eSMP series SMF (DO-219AB) package.

  4. Nanoscale Transistors Could Enable More Efficient Electronics 11/4/2024

    Silicon transistors, which are used to amplify and switch signals, are a critical component in most electronic devices, from smartphones to automobiles. But silicon semiconductor technology is held back by a fundamental physical limit that prevents transistors from operating below a certain voltage.

  5. KYOCERA AVX Releases Industry's First Dual-Entry Card-Edge Connectors 10/30/2024

    The new 9159-800 Series dual-entry vertical card-edge connectors also offer its lowest above-board height profile and provide customers in the automotive, transportation, industrial manufacturing, consumer electronics, and white goods industries with space savings, flexibility, and high-reliability performance.

  6. DuPont And Zhen Ding Technology Group Sign Strategic Cooperation Agreement To Advance High-End Printed Circuit Board Technology Development 10/29/2024

    DuPont (NYSE: DD) and Zhen Ding Technology Group (Zhen Ding) (4958-TW) announced they have entered into a strategic cooperation agreement in advanced printed circuit board (PCBs) technology.

  7. MIT Team Takes A Major Step Toward Fully 3D-Printed Active Electronics 10/22/2024

    Active electronics — components that can control electrical signals — usually contain semiconductor devices that receive, store, and process information.

  8. Vishay Intertechnology Extends Voltage Rating Options For Four-Terminal Snap-In Aluminum Electrolytic Capacitors 10/16/2024

    Vishay Intertechnology, Inc. (NYSE: VSH) is extending its 299 PHL-4TSI snap-in, four-terminal aluminum electrolytic capacitor family with new 350 V, 500 V, 550 V, and 600 V rated capacitors that greatly expand the range of capacitance-voltage combinations available to designers.

  9. NVIDIA Contributes Blackwell Platform Design To Open Hardware Ecosystem, Accelerating AI Infrastructure Innovation 10/15/2024

    OCP Global Summit—To drive the development of open, efficient and scalable data center technologies, NVIDIA today announced that it has contributed foundational elements of its NVIDIA Blackwell accelerated computing platform design to the Open Compute Project (OCP) and broadened NVIDIA Spectrum-X support for OCP standards.

  10. Future Electronics And Infineon To Host Webinar On LV MOSFET Technology 10/10/2024

    Future Electronics, a global leader in electronics components distribution, is excited to announce a live webinar dedicated to exploring Infineon’s latest advancements in low voltage (LV) metal–oxide–semiconductor field-effect transistor (MOSFET) technology for industrial applications.