Latest Headlines

  1. Digital Enhancement Unveils First Commercial RPU (Radio Processing Unit), Marking A Leap In Wireless Performance For Consumer Electronics 1/6/2025

    Digital Enhancement (Hangzhou) Co., Ltd (hereafter referred to as "Digital Enhancement") is set to unveil the world's first commercial-grade Radio Processing Unit (RPU) designed for Wi-Fi wireless access at the CES International Consumer Electronics Show in Las Vegas, USA.

  2. Laser Photonics Propels R&D Efforts In PCB Depaneling 12/31/2024

    Laser Photonics Corporation (“LPC”), a leading global developer of industrial laser systems for cleaning and other material processing applications, and its subsidiary, Control Micro Systems (CMS Laser), announced the expansion of their Printed Circuit Board (PCB) Depaneling technology development project for the electronics market.

  3. Richardson Electronics, Ltd. Announces Two Multi-Million Dollar Contracts For Its Patented Ultracapacitor Pitch Energy Modules 12/17/2024

    Richardson Electronics, Ltd. (NASDAQ: RELL), a global provider of engineered solutions for renewable energy and other power management applications, announced today two multi-million dollar production contracts with two of the world's largest owners and operators of wind farms in North America for Richardson’s patented ultracapacitor pitch energy modules (PEMs) and other related products.

  4. KYOCERA AVX Releases Industry's Highest Power 0603 Resistor 12/12/2024

    KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, expanded its selection of CR Series high-power chip resistors with the addition of the industry’s highest power 0603 resistor.

  5. Inductors: TDK Launches The Industry's Smallest Thin-Film Power Inductors 12/12/2024

    TDK Corporation announces the introduction of its new PLE856C Series (0.80 x 0.45 x 0.65 mm; L x W x T) of compact thin-film power inductors for wearable devices. Mass production of these new components began this month, in December 2024.

  6. Vishay Intertechnology 1 Form A Solid-State Relay Offers 600 V Load Voltage And Isolation Voltage Of 3750 VRMS In SOP-4 Package 12/11/2024

    Vishay Intertechnology, Inc. today introduced a 1 Form A solid-state relay offering a 600 V load voltage and isolation voltage of 3750 VRMS in the low profile SOP-4 package.

  7. ROHM's EcoSiC Technology Has Been Adopted In COSEL's HFA/HCA Series Of 3.5kW Output AC-DC Power Supply Units 12/4/2024

    ROHM has announced the adoption of its EcoSiC products, including SiC MOSFETs and SiC Schottky barrier diodes (SBDs) in the HFA/HCA series of 3.5kW output AC-DC power supply units for 3-phase applications from COSEL, a leading power supply manufacturer in Japan. Incorporating ROHM SiC MOSFETs and SiC SBDs into the forced air-cooled HFA series and conduction-cooled HCA series achieves up to 94% efficiency.

  8. Polymatech Electronics Partners With South Wales SME 'SimplyRFMW' To Advance 5G And 6G RF Power Amplifier Designs 11/28/2024

    Polymatech Electronics, a global pioneer in semiconductor chip manufacturing headquartered in Chennai, India, has announced a strategic partnership with SimplyRFMW Limited, a South Wales-based SME renowned for its expertise in RF and microwave engineering.

  9. Valeo And ROHM Semiconductor Co-Develop Next-Generation Power Electronics 11/27/2024

    ROHM Semiconductor GmbH, a group company of ROHM Co., Ltd., a leading semiconductor/electronic component manufacturer in Japan, will provide its 2-in-1 silicon carbide (SiC) molded module, the TRCDRIVE pack (TM), to Valeo S.A., a Paris-based leading automotive technology company, for future powertrain solutions.

  10. OptiMOS Linear FET 2 MOSFET Enables Optimal Hot-Swap And Battery Protection 11/13/2024

    The safe hot-swap operation in AI servers and telecom requires MOSFETs with a robust linear operating mode as well as a low R DS(on).