Latest Headlines
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HKU Engineering Researchers Develop Soft, 3D Transistors With Hosting Living Cell Potential, Featured On Science Cover
1/15/2026
The WISE research group (Wearable, Intelligent, Soft Electronics) at The University of Hong Kong (HKU-WISE) have addressed a long-standing bioelectronic challenge: the development of soft, 3D transistors.
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Vishay Intertechnology Extends 193 PUR-SI Series Of Snap-in Power Aluminum Capacitors With Voltage Ratings Of 550 V And 600 V
1/14/2026
Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company has extended its 193 PUR-SI series of miniature snap-in power aluminum electrolytic capacitors with new voltage ratings of 550 V and 600 V.
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Siemens Acquires ASTER Technologies To Deliver Industry-Leading PCB Test Engineering Solutions
1/13/2026
Siemens today announced it has acquired ASTER Technologies (“ASTER”), a privately held market leader in printed circuit board assembly (PCBA) test verification and engineering software.
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Patton Creates Revolutionary 100 Gigabit Data Diode SFP Module
1/7/2026
Patton—US manufacturer of world-class cybersecurity solutions—announces the FiberPlex QSFX-100DD Data Diode SFP Module, a new generation of high-security pluggable optics, is now available for pre-order, with delivery expected April 2026.
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Menlo Micro Cryogenic Switches Set New Benchmark For RF Switches Within Quantum Computing Systems
1/6/2026
Menlo Microsystems, Inc. (Menlo Micro), the company setting a new standard for switches in modern electrical and electronic systems, announced the launch of the MM4250 switch.
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Chonnam National University Researchers Propose Innovative Voltage-Loop Control For Power Factor Correction
12/18/2025
Single-phase power factor correction (PFC) circuits—a kind of front-end AC/DC converters—are ubiquitous in a variety of consumer electronic devices, including laptop adapters, LED driver power supplies, and portable chargers.
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New Materials Could Boost The Energy Efficiency Of Microelectronics
12/11/2025
MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics by stacking multiple functional components on top of one existing circuit.
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TAIYO YUDEN Commercializes The 'HVX (-J)' And 'HTX (-J)' Series Of Conductive Polymer Hybrid Aluminum Electrolytic Capacitors Featuring A Higher Rated Ripple Current And Lower Profile Than Earlier Models
12/2/2025
TAIYO YUDEN CO., LTD. has commercialized the new "HVX (-J)" and "HTX (-J)" series of conductive polymer hybrid aluminum electrolytic capacitors (hereinafter referred to as "hybrid capacitors") by revamping its "HVX" and "HTX" series, which comply with the AEC-Q200 Stress Test Qualification for Passive Components.
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DigiKey Debuts Industry-First Power Supply Configuration Tool
11/25/2025
DigiKey, the leading global electronic components and automation products distributor, has introduced an industry-first power supply configuration tool, which simplifies the process of designing power supply solutions.
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Vishay Intertechnology Releases 1500 V 1 Form A Solid-State Relay In 4-Pin SMD-8 Package For 800 V Battery Monitoring Systems
11/25/2025
Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new 1500 V Automotive Grade 1 Form A solid-state relay in a 4-pin SMD-8 package.