Latest Headlines
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Cornell Dubilier Introduces Low Inductance DC Link Film Capacitors
3/13/2023
To support the needs of high-frequency switching inverters and converters, Cornell Dubilier Electronics, Inc. has announced its 944L Series of low inductance, high current DC link film capacitors
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ROHM’s New ±1% Accuracy Current Sense Amplifier ICs Reduce Mounting Area By Approximately 46% Over Conventional Configurations
3/9/2023
ROHM Semiconductor today announced the BD1421x-LA series of space-saving, high accuracy current sense amplifier ICs for industrial (e.g., wireless base stations, PLCs, inverters) and consumer applications (e.g., home appliances)
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Magnachip Unveils Super-Short Channel MXT MOSFETs For Smartphone Battery Protection Circuit Modules
3/2/2023
Magnachip Semiconductor Corporation ("Magnachip") (NYSE: MX) announced today that the company has released two seventh-generation MXT Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs), built on its Super-Short Channel technology, for the battery protection circuit modules in smartphones
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L-com Expands Line Of AC And DC Current Sensors For IoT Applications
2/28/2023
L-com, an Infinite Electronics brand and a supplier of wired and wireless connectivity products, today announced it has expanded its line of AC and DC current sensors
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KYOCERA AVX Announces New MIL-PRF-32535 BME NP0 MLCCs Approved To The DLA QPD
2/15/2023
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is proud to announce that its MIL-PRF-32535 BME NP0 MLCCs have been approved to the Defense Logistics Agency (DLA) Qualified Products Database (QPD).
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Custom Capacitor Assemblies
2/15/2023
Passive Plus (PPI) offers Custom Capacitor Assemblies for high power requirements.
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TDK Offers Very Compact Snap-In Aluminum Electrolytic Capacitors With 85 Percent Increased Ripple Current Capability
2/9/2023
TDK Corporation (TSE:6762) presents its new EPCOS B43652* series of snap-in aluminum electrolytic capacitors that are characterized by very compact dimensions and very high ripple current-carrying capacity.
- Infineon QDPAK And DDPAK Top-Side Cooling Packages Registered As JEDEC Standard For High-Power Applications 2/9/2023
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Rheinmetall Joint Venture Wins First Customer With Multimillion-Euro Order For DC-Link Capacitors With Forward-Looking NanoLam Technology
2/7/2023
Rheinmetall PolyCharge GmbH, a joint venture of Rheinmetall AG and PolyCharge America, Inc., has received its first order in the mid double-digit million euro range one year after it was founded. Its first customer, a well-known, globally operating supplier to the automotive industry, has ordered two different DC-link capacitors for applications in the 900V range, which are produced with the innovative NanoLam technology.
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Vishay Intertechnology Automotive Grade vPolyTan Polymer Tantalum Chip Capacitors Combine Low ESR With High Volumetric Efficiency
2/1/2023
Vishay Intertechnology, Inc. today introduced a new Automotive Grade series of vPolyTan surface-mount polymer tantalum molded chip capacitors.