Latest Headlines

1. TAIYO YUDEN Commercializes The Electric Double-Layer Capacitor LT Series 7/16/2021

   TAIYO YUDEN CO., LTD. announced the commercialization of its cylinder-type electric double-layer capacitor LT series featuring eight products, including the LT08202R7335 (φ8.0 × 20 mm, nominal capacitance 3.3 F)

2. Teledyne e2v HiRel Partners With Integra Technologies Inc. To Launch 100V GaN/SiC RF Power Technology For High Reliability Aerospace & Defense Applications 7/14/2021

   Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced that it will be offering High Reliability qualified versions of California-based Integra Technologies, Inc. (Integra) new 100V Gallium Nitride on Silicon Carbide (GaN/SiC) power transistors.

3. Alliance Memory 8Gb LPDDR4X SDRAM Offers ~50% Reduction In Power Consumption Compared To LPDDR4 Devices 7/14/2021

   Alliance Memory today announced that it has expanded its offering of high-speed CMOS mobile low-power SDRAMs with a new LPDDR4X device featuring on-chip ECC

4. Teledyne Relays Announces Four New Reed Relay Families For High Reliability Applications 7/13/2021

   Teledyne Relays today announced availability of four new reed relay product families, all offering extremely long life of up to 1 billion cycles, ideal for applications where high reliability is essential

5. High-Capacitance, Low Profile Metallized Polypropylene Film Capacitor Released By New Yorker Electronics 7/12/2021

   New Yorker Electronics has announced the release of the new CDE-Illinois Capacitor MTPS high-capacitance, low-profile metalized polypropylene film capacitor series.

6. CMTC Helps Resistor Manufacturer Select & Implement A New ERP System For Improved Operations 7/8/2021

   California Manufacturing Technology Consulting (CMTC) helped Riedon, Inc. investigate new business systems to provide their decision-makers with easier access to information about business operations, sales, and markets

7. Infineon And Amber To Collaborate On Commercialization Of Amber's Breakthroughs For Digital Control Of Electricity In Silicon Architecture 7/7/2021

   Infineon Technologies and Amber Solutions today announced an alliance on a range of silicon opportunities anchored around Amber's breakthrough digital control of electricity with embedded intelligence

8. Micross Expands Capabilities With The Acquisition Of The Microelectronics Business Assets Of Ultra CEMS 7/7/2021

   Micross Components, Inc. (“Micross”), a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications announced the expansion of its Hybrid and assembly business with the acquisition of assets of the microelectronics business from Ultra CEMS (“Ultra”), a leading provider of high reliability hybrid electronics engineered for the harshest environments.

9. Cambridge Mechatronics Launches Best In Class Driver ICs For Shape Memory Alloy Applications 7/2/2021

   Cambridge Mechatronics Limited (CML), world leaders in system level solutions for Shape Memory Alloy (SMA) applications, is pleased to announce CM401, CML’s own driver chip for SMA actuators

10. Nordson Electronics Solutions Introduces The MARCH MegaVIA Plasma Treatment System For Large Panels In Printed Circuit Board Manufacturing 6/30/2021

    Nordson Electronics Solutions, a division of Nordson Corporation a global leader in plasma processing technology, introduces the MARCH MegaVIA Plasma Treatment System with a 15-cell configuration for panel sizes up to 30 x 52 inches in printed circuit board manufacturing