Latest Headlines

  1. Power Integrations Extends Flyback Topology To Enable 440 W, Offering Simpler Alternatives To Resonant Power Designs 3/23/2026

    Power Integrations the leader in high-voltage integrated circuits for energy-efficient power conversion, today introduced a breakthrough in flyback topology extending the power range of flyback converters to 440 W—well beyond the limits that traditionally required more complex resonant and LLC topologies.

  2. SimpleChips Ships Industry's First 1200V High-Voltage Monitor IC 3/19/2026

    APEC 2026 — In booth 2218, SimpleChips Technology Inc., a global provider of analog and mixed-signal application-specific integrated circuits (ASICs) for automotive, medical, industrial and aerospace applications, today announced the availability of the 18SCT005, the industry’s first 1200V high-voltage monitor IC.

  3. Interstate Connecting Components (ICC) Announces Addition Of Amphenol Fiber Systems VITA 87 High-Density MT Connectors 3/19/2026

    Interstate Connecting Components (ICC), a leading distributor of electronic components for the military and aerospace industries, announces a new product introduction of Amphenol Fiber Systems VITA 87 high-density circular MT connectors.

  4. Toshiba Releases Photovoltaic-Output Photocoupler For Automotive Equipment 3/18/2026

    Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched a photovoltaic-output photocoupler, "TLX9920", in a thin, long-creepage-distance SO6L package, for solid state relays (SSR)[1] in automotive equipment. Volume shipments start today.

  5. Molex Accelerates AI Cluster Deployment With One-Stop Optical Interconnect Architecture And Debut Of High-Radix Optical Circuit Switch Platform 3/17/2026

    Molex, a global electronics leader and connectivity innovator, has unveiled a robust product roadmap for delivering the full technology stack needed to address the massive scaling requirements of hyperscale data centers.

  6. HyperLight Demonstrates Low-Power 1.6T-DR8 TFLN-Based Reference Transceiver Assembled By TFC 3/16/2026

    HyperLight Corporation (“HyperLight”) today announced a major milestone in low-power optical networking with the demonstration of a 1.6T-DR8 optical transceiver leveraging HyperLight’s TFLN Chiplet Platform.

  7. TI Expands Microcontroller Portfolio And Software Ecosystem To Enable Edge AI In Every Device 3/10/2026

    Texas Instruments (TI) (Nasdaq: TXN) today introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio.

  8. TDK Introduces Compact Thermofuse Varistors For Surge Protection Of Up To 50 kA 3/4/2026

    TDK Corporation has introduced the MT40 series of ThermoFuse varistors (ordering code B72240M), a new generation of surge protection components (SPC) that combine a compact design with advanced safety features.

  9. Littelfuse Launches CPC1343G OptoMOS Solid-State Relay For High-Current, High-Isolation Applications 3/3/2026

    Littelfuse, Inc an industrial technology manufacturing company shaping solutions for the safe and efficient transfer of electrical energy, today announced the launch of the CPC1343G OptoMOS Solid-State Relay, a compact, normally open (1-Form-A) OptoMOS relay designed for high-reliability switching in demanding industrial, medical, and instrumentation applications

  10. Micross Introduces H+ Screened DC-DC Converters For LEO Constellations And New Space Missions 3/3/2026

    Micross Components, Inc. ("Micross"), a global provider of Hi-Rel microelectronic products and services for aerospace, defense, space, medical, and industrial applications, has expanded its DC-DC converter portfolio with the new Class H+ AFLS28XX Series.