Latest Headlines

  1. OKI Develops Tiling Crystal Film Bonding (CFB) Technology For Heterogeneous Integration Of Optical Semiconductors Onto 300 mm Silicon Wafers 8/14/2025

    OKI has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology.

  2. Authorized Distributor Mouser Electronics Offers Wide Portfolio Of Products From Infineon Technologies AG 8/12/2025

    Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is an authorized global distributor of solutions from Infineon Technologies AG, a global semiconductor leader in power systems and IoT.

  3. Precision Timing To Power The Future Montage Technology Unveils High-Performance Clock Chip Portfolio 8/8/2025

    Montage Technology today announced customer sampling of its clock buffer and spread-spectrum oscillator products, following the successful mass production of its clock generator chips.

  4. KYOCERA AVX Introduces New Hermaphroditic WTW & WTB Connectors 8/7/2025

    KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new 9288-000 Series hermaphroditic wire-to-wire (WTW) and wire-to-board (WTB) connectors for lighting and industrial applications.

  5. TDK Introduces Compact Double-Sided Metallized Polypropylene Film Capacitors For Resonant Topologies 8/5/2025

    TDK Corporation presents its new EPCOS B3264xH series of double-sided metallized polypropylene film capacitors (MMKP).

  6. Lightium, MPI Corporation And Axiomatic_AI Announce Strategic Partnership To Revolutionize Photonic Integrated Circuit (PIC) Testing With AI-Powered Solutions 8/5/2025

    Lightium AG , MPI Corporation , and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices.

  7. Nexperia Launches ESD Protection Diodes For USB4 And Thunderbolt Ensuring Signal Integrity Beyond 10 GHz 8/5/2025

    Nexperia today introduced a new series of five high-performance protection 1 V diodes that provide optimized protection for AC-coupled radio-frequency (RF) transmission lines against electrostatic discharge (ESD) events, surge currents and short circuit conditions.

  8. Vishay Intertechnology Uni/Bidirectional 1500 W PAR TVS Solutions Offer High Temperature Operation To +185 °C In SMB (DO-214AA) Package 7/30/2025

    Vishay Intertechnology, Inc. today introduced a new series of uni/bidirectional 1500 W surface-mount PAR transient voltage suppressors (TVS) in the SMB (DO-214AA) package.

  9. Renesas Introduces 64-bit RZ/G3E MPU For High-Performance HMI Systems Requiring AI Acceleration And Edge Computing 7/29/2025

    Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, today announced the launch of its new 64-bit RZ/G3E microprocessor (MPU), a general-purpose device optimized for high-performance Human Machine Interface (HMI) applications.

  10. Magnachip Introduces TOLT-Packaged 80V MXT MV MOSFET For E-Scooters And LEVs 7/28/2025

    Magnachip Semiconductor Corporation (“Magnachip” or “Company”) today announced the release of a new 80V MXT MV MOSFET, MDLT080N017RH, featuring a TOLT (TO-Leaded Top-Side Cooling) package.