Latest Headlines

  1. KEMET Advances Its Latest Environmental Sensor Solutions For Industrial Applications 6/18/2020

    KEMET (“KEMET” or the “Company”), a subsidiary of Yageo Corporation (“Yageo”) (TAIEX: 2327), a leading global supplier of electronic components, continues to strengthen its solutions for industrial applications with its range of environmental PIR sensors

  2. Cornell Dubilier Updates Energy Dense, Very Low-Profile Capacitors Now 5,000 Hr. Rated 6/17/2020

    irst introduced in 2018, Cornell Dubilier Electronics, Inc. (CDE) has made significant design tweaks to their groundbreaking THA and THAS Series Thinpack capacitors

  3. ROHM’s New 4th Generation SiC MOSFETs Featuring The Industry’s Lowest ON Resistance 6/17/2020

    ROHM announces the cutting-edge 4th Generation 1200V SiC MOSFETs optimized for automotive powertrain systems, including the main drive inverter, as well as power supplies for industrial equipment

  4. SmartSens Announces The First 1080P Sensor In Its Advanced Imaging (AI) Series 6/16/2020

    SmartSens Technology today announced the launch of its SC200AI sensor, the first in a new Advanced Imaging (AI) series product lineup of high-performance, low-light-capable image sensors with advanced HDR capabilities and reliability in harsh environments

  5. Digi-Key Electronics Announces U.S. Distribution Partnership With American Zettler 6/10/2020

    Digi-Key Electronics, a global electronic components distributor, announced that it has expanded its product portfolio by signing a U.S. distribution partnership with American Zettler, providing Digi-Key customers with a wide range of electromechanical relays from American Zettler, Zettler Magnetics and AZ Displays

  6. Vishay Intertechnology Lowers TCR For TNPU e3 Series Ultra Precision Thin Film Flat Chip Resistors In 0603, 0805, And 1206 Case Sizes 5/27/2020

    Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company has extended its TNPU e3 series of Automotive Grade ultra precision thin film flat chip resistors with lower temperature coefficients down to ± 2 ppm/K in the 0603, 0805, and 1206 case sizes

  7. SENKO Announces Major Advancements In The Adoption Of SN® Connectors And Transceivers 5/21/2020

    SENKO Advanced Components, Inc. (SENKO) announced today there have been major advancements in the adoption and continued deployment of its SN® Connector technology and supporting ecosystem after two years of field trials

  8. DuPont Electronics & Imaging Interconnect Solutions Introduces New Metallization Offerings For High-Density Interconnect Applications In Printed Circuit Boards 5/12/2020

    DuPont Electronics & Imaging Interconnect Solutions (ICS), the leading integrated materials solution partner for advanced interconnects, today introduced new metallization offerings in advanced development stages for High-Density Interconnect (HDI) applications, a high-performance and fast-growing segment of the printed circuit board (PCB) industry

  9. Renesas Extends Bluetooth 5.0 Connectivity To RA Family Of 32-Bit MCUs With Arm Cortex-M Core 5/7/2020

    Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introducethe first RA microcontroller (MCU) with an integrated Bluetooth 5.0 Low Energy radio.

  10. Nano Dimension’s AME Technology Facilitates REHAU’s Development Of A 3D Touch Sensor 5/7/2020

    Nano Dimension Ltd. (Nasdaq, TASE: NNDM), a leading Additively Manufactured Electronics (AME)/PE (Printed Electronics) provider and REHAU, a worldwide-leading polymer manufacturer, announced today that they succeeded in printing a 3D touch sensor