Latest Headlines

  1. CEVA Redefines High Performance AI/ML Processing For Edge AI And Edge Compute Devices With Its NeuPro-M Heterogeneous And Secure Processor Architecture 1/6/2022

    CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced NeuPro-M, its latest generation processor architecture for artificial intelligence and machine learning (AI/ML) inference workloads.

  2. ADLINK Launches COM-HPC Client Type And COM Express Type 6 Modules With 12th Gen Intel® Core™ Processors 1/4/2022

    ADLINK Technology Inc., a global leader in edge computing, introduces the world’s first 12th Gen Intel Core processor-based Computer-on-Modules (COMs), available in two form factors – COM-HPC Client Type and COM Express Type 6.

  3. SK Broadband Partners With DSP Concepts To Deliver Immersive Home Entertainment With Audio Weaver 12/17/2021

    Today, DSP Concepts, whose Audio Weaver framework powers sound and voice for many of the world's best consumer and automotive brands, announced its work with SK Broadband to develop the company's latest device, a  fully equipped set-top box, the AI Sound Max.

  4. Knowles Partners With Ole Wolff To Deliver Compact Hybrid Driver For TWS Earphones With HD Audio And ANC 12/16/2021

    Knowles Corporation, a market leader and global provider of advanced micro-acoustic microphones, speakers, audio solutions, and high performance capacitors and RF products, and Ole Wolff, a manufacturer of high quality speakers, receivers, and provider of acoustic system integration, today announced the result of their cooperation to improve the comfort and performance of True Wireless Stereo (TWS) earphones with high-definition audio and active noise cancellation (ANC).

  5. Centec Partners With MaxLinear For Next-generation Multi-Gigabit Whitebox Switch Solutions 12/16/2021

    MaxLinear, Inc. announced today that Centec has chosen it as a partner for next generation Multi-Gigabit whitebox switch solutions leveraging the newly released MaxLinear 2.5G Ethernet Quad-port PHY (GPY241).

  6. Toshiba’s New 4-Form-A, Voltage Driven Photorelays Have One Of Industry’s Smallest Mounting Areas, Will Help Reduce Semiconductor Tester Sizes 12/15/2021

    Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched three 4-Form-A voltage driven photorelays, “TLP3407SRA4,” “TLP3412SRHA4,” and “TLP3475SRHA4,” that have one of the smallest mounting areas in the industry.

  7. BorgWarner Enters Licensing Agreement With PolyCharge America, Inc. For Disruptive Capacitor Technology 12/15/2021

    BorgWarner is strengthening its inverter capabilities and offerings through an exclusive licensing agreement with PolyCharge America, Inc., a startup company formed to deliver disruptive capacitor products.

  8. Seagate Fuels Converged Storage Platform With New Exos AP Enterprise Data Storage System Controller Powered By AMD EPYC Processors 12/14/2021

    Managing massive datasets is excessively complex and costly. Today, Seagate Technology Holdings plc, a world leader in mass-data storage infrastructure solutions, announced the new Exos Application Platform (AP) with a new controller featuring 2nd Gen AMD EPYC processors. 

  9. 65 A ePower Chipset From Efficient Power Conversion (EPC) Redefines Power Conversion 12/14/2021

    EPC announces the introduction of a 100 V, 65 A integrated circuit chipset designed for 48 V DC-DC conversion used in high-density computing applications and in 48 V BLDC motor drives for e-mobility, robotics, and drones.

  10. UltraSense Systems Brings Neural Processing To Smart Surfaces With A New Generation Of Multi-Mode Sensing Solutions 12/14/2021

    UltraSense Systems today announced its next generation of multi-mode touch sensing technology with the release of TouchPoint Edge to revolutionize and cost-effectively replace a cluster of mechanical buttons under any surface material (e.g., metal, glass, plastic, etc.) and further forge the UI/UX paradigm shift from mechanical to digital interfaces for smart surfaces.