Latest Headlines
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Vishay Intertechnology Wet Tantalum Capacitor Offers Industry-High Capacitance, Mechanical Robustness For Military And Avionics Systems
5/25/2022
To meet the needs of military and avionics applications, Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new high energy wet tantalum capacitor that delivers the industry’s highest capacitance per voltage rating and case size for this device type.
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The Smallest 40 V, 1.1 mΩ FET In The World From EPC Enables State-Of-The-Art Power Density
5/25/2022
Efficient Power Conversion Corporation, the world’s leader in enhancement-mode gallium nitride (eGaN) power FETs and ICs, expands the selection of low voltage, off-the-shelf gallium nitride transistors with the introduction of the EPC2066 (0.8 mΩ typical, 40 V) GaN FET.
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Heilind Electronics Now Stocking RJF And RJFTV Cat 6A Harsh Environment Connectors From Amphenol Pcd
5/18/2022
Heilind Electronics, a leading global distributor of electronic components and authorized distributor for Amphenol Pcd, is now stocking the manufacturer’s RJF and RJFTV6A Series of Cat 6A modular Ethernet connectors.
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High Efficiency Low Voltage 3A Buck Converter From Diodes Incorporated Targets High Power Density Automotive Designs
5/11/2022
Diodes Incorporated (Diodes) has introduced the automotive-compliant DIODES™ AP61300Q and DIODES™ AP61302Q synchronous buck converters.
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Mitsubishi Electric Expands Silicon Carbide Power Device Lineup With Industry Standard Package Dual Device
5/11/2022
Mitsubishi Electric US, Inc. recently launched a new Silicon Carbide (SiC) power module FMF400DY-24B.
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Allegro MicroSystems Achieves Major Milestone Of Three Billion Motor Driver Integrated Circuits Shipped
5/4/2022
Allegro MicroSystems, Inc. (“Allegro”) (Nasdaq: ALGM), a global leader in sensing and power solutions for motion control and energy-efficient systems, today announced that it has shipped its three billionth motor driver integrated circuit (IC), underpinning the strength of its motion control business.
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Space-Saving Schottky Rectifiers From Diodes Incorporated Set New Benchmarks In Current Density
4/27/2022
Diodes Incorporated (Diodes) has announced the introduction of a series of high-current Schottky rectifiers in ultra-compact chip scale packages (CSPs).
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ROHM Expands Lineup Of Compact PMDE Package Diodes: Contributing To Application Miniaturization
4/26/2022
ROHM Semiconductor today announced the addition of 14 new models to their PMDE package (2.5mm × 1.3mm) lineup – meeting the requirements for smaller protection and switching circuits (RBxx8 Series, RFN Series, VS Series).
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Applied Materials Technologies Enable 2D Scaling With EUV And 3D Gate-All-Around Transistors
4/21/2022
Applied Materials, Inc. today introduced innovations that help customers continue 2D scaling with EUV and detailed the industry’s broadest portfolio of technologies for manufacturing next-generation 3D Gate-All-Around transistors.
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Teradyne Marks The 7,000th J750 Semiconductor Test System Shipment With Nations Technologies
4/20/2022
Teradyne, Inc. (NASDAQ:TER), a leading supplier of automated test equipment, today announced the shipment of the 7,000th unit of its industry-leading J750 semiconductor test platform to Nations Technologies, a leading Chinese microcontroller unit (MCU) and security integrated circuit (IC) chip maker.