Latest Headlines
-
OptiMOS Linear FET 2 MOSFET Enables Optimal Hot-Swap And Battery Protection
11/13/2024
The safe hot-swap operation in AI servers and telecom requires MOSFETs with a robust linear operating mode as well as a low R DS(on).
-
Renesas Introduces New AnalogPAK Programmable Mixed-Signal ICs, Including First Low-Power Device With 14-Bit SAR ADC
11/12/2024
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced new AnalogPAK ICs, including lower power and automotive-qualified devices along with the industry’s first programmable 14-bit SAR ADC (Successive-Approximation Register Analog-Digital Converter).
-
Fairview Microwave Introduces Surface-Mount Failsafe Electromechanical Relay Switches
11/7/2024
Fairview Microwave, an Infinite Electronics brand and a leading provider of on-demand RF, microwave and millimeter-wave components, has announced its latest offering: the Quartz Series of surface-mount failsafe electromechanical relay switches.
-
Vishay Intertechnology Releases New 1 A And 2 A Gen 7 1200 V FRED Pt Hyperfast Rectifiers In eSMP Series SMF (DO-219AB) Package
11/6/2024
Vishay Intertechnology, Inc. today expanded its Gen 7 platform of 1200 V FRED Pt Hyperfast rectifiers with four new Automotive Grade devices in the eSMP series SMF (DO-219AB) package.
-
Nanoscale Transistors Could Enable More Efficient Electronics
11/4/2024
Silicon transistors, which are used to amplify and switch signals, are a critical component in most electronic devices, from smartphones to automobiles. But silicon semiconductor technology is held back by a fundamental physical limit that prevents transistors from operating below a certain voltage.
-
KYOCERA AVX Releases Industry's First Dual-Entry Card-Edge Connectors
10/30/2024
The new 9159-800 Series dual-entry vertical card-edge connectors also offer its lowest above-board height profile and provide customers in the automotive, transportation, industrial manufacturing, consumer electronics, and white goods industries with space savings, flexibility, and high-reliability performance.
-
DuPont And Zhen Ding Technology Group Sign Strategic Cooperation Agreement To Advance High-End Printed Circuit Board Technology Development
10/29/2024
DuPont (NYSE: DD) and Zhen Ding Technology Group (Zhen Ding) (4958-TW) announced they have entered into a strategic cooperation agreement in advanced printed circuit board (PCBs) technology.
-
MIT Team Takes A Major Step Toward Fully 3D-Printed Active Electronics
10/22/2024
Active electronics — components that can control electrical signals — usually contain semiconductor devices that receive, store, and process information.
-
Vishay Intertechnology Extends Voltage Rating Options For Four-Terminal Snap-In Aluminum Electrolytic Capacitors
10/16/2024
Vishay Intertechnology, Inc. (NYSE: VSH) is extending its 299 PHL-4TSI snap-in, four-terminal aluminum electrolytic capacitor family with new 350 V, 500 V, 550 V, and 600 V rated capacitors that greatly expand the range of capacitance-voltage combinations available to designers.
-
NVIDIA Contributes Blackwell Platform Design To Open Hardware Ecosystem, Accelerating AI Infrastructure Innovation
10/15/2024
OCP Global Summit—To drive the development of open, efficient and scalable data center technologies, NVIDIA today announced that it has contributed foundational elements of its NVIDIA Blackwell accelerated computing platform design to the Open Compute Project (OCP) and broadened NVIDIA Spectrum-X support for OCP standards.