Latest Headlines

31. New Renesas USB-C Power Solution With Innovative Three-Level Topology Improves Performance And Reduces System Size 8/20/2025

    Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, today introduced the RAA489300/RAA489301 high-performance buck controller designed with a three-level buck topology used for battery charging and voltage regulation in USB-C systems such as multiple-port USB-PD chargers, portable power stations, PC docking station, robots, drones, and other applications that need a high efficiency DC/DC controller.

32. Precision Timing To Power The Future Montage Technology Unveils High-Performance Clock Chip Portfolio 8/8/2025

    Montage Technology today announced customer sampling of its clock buffer and spread-spectrum oscillator products, following the successful mass production of its clock generator chips.

33. KYOCERA AVX Introduces New Hermaphroditic WTW & WTB Connectors 8/7/2025

    KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new 9288-000 Series hermaphroditic wire-to-wire (WTW) and wire-to-board (WTB) connectors for lighting and industrial applications.

34. TDK Introduces Compact Double-Sided Metallized Polypropylene Film Capacitors For Resonant Topologies 8/5/2025

    TDK Corporation presents its new EPCOS B3264xH series of double-sided metallized polypropylene film capacitors (MMKP).

35. Lightium, MPI Corporation And Axiomatic_AI Announce Strategic Partnership To Revolutionize Photonic Integrated Circuit (PIC) Testing With AI-Powered Solutions 8/5/2025

    Lightium AG , MPI Corporation , and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices.

36. Nexperia Launches ESD Protection Diodes For USB4 And Thunderbolt Ensuring Signal Integrity Beyond 10 GHz 8/5/2025

    Nexperia today introduced a new series of five high-performance protection 1 V diodes that provide optimized protection for AC-coupled radio-frequency (RF) transmission lines against electrostatic discharge (ESD) events, surge currents and short circuit conditions.

37. Vishay Intertechnology Uni/Bidirectional 1500 W PAR TVS Solutions Offer High Temperature Operation To +185 °C In SMB (DO-214AA) Package 7/30/2025

    Vishay Intertechnology, Inc. today introduced a new series of uni/bidirectional 1500 W surface-mount PAR transient voltage suppressors (TVS) in the SMB (DO-214AA) package.

38. Vishay Intertechnology Gen 3 650 V And 1200 V SiC Schottky Diodes Increase Efficiency While Enhancing Electrical Insulation 7/22/2025

    Vishay Intertechnology, Inc. (NYSE: VSH) today introduced three new Gen 3 650 V and 1200 V silicon carbide (SiC) Schottky diodes in the compact, low profile SlimSMA HV (DO-221AC) package.

39. SisTech Manufacturing Leads The Charge Against Electronic Component Obsolescence With Innovative Solutions 7/21/2025

    SisTech Manufacturing recently rolled out advancements to its Electronic Manufacturing Services.

40. Rapidus Achieves Significant Milestone At Its State-Of-The-Art Foundry With Prototyping Of Leading-Edge 2nm GAA Transistors 7/18/2025

    Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced that prototyping has started for its 2nm gate-all-around (GAA) transistor structure at Rapidus' Innovative Integration for Manufacturing (IIM-1) foundry. The prototype wafers also started to obtain their electrical characteristics.