Latest Headlines

  1. OKI Develops 180-Layer 15 mm-Thick PCB Technologies For Next-Generation AI Semiconductor Testing Equipment 4/27/2026

    OKI Circuit Technology (OTC; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group's printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) (*1) mounted on AI semiconductors.

  2. ROHM Develops 5th Generation SiC MOSFETs With Approximately 30% Lower On-Resistance At High Temperatures 4/21/2026

    ROHM Semiconductor today announced it has developed the latest device of its EcoSiC™ series: the 5th Generation SiC MOSFETs optimized for high‑efficiency power applications.

  3. Artilux Announces Inception™: A Hybrid Optoelectronic Architecture For The Next-Generation AI Computing 4/15/2026

    Artilux today announced Inception™, an AI computing paradigm shift from conventional digital electronics to novel hybrid optoelectronics, delivering orders-of-magnitude improvements in both power and area efficiencies without relying on advanced CMOS process nodes and active cooling.

  4. TDK Enables Compact 1250 V DC Converter Designs With A New High-Voltage Common-Mode Choke 4/15/2026

    TDK Corporation presents the B82722V6*B040 series of new compact high-voltage, current-compensated ring-core double chokes. Designed primarily for rated DC voltages of up to 1250 V (630 V AC), these compact common-mode chokes (23 x 15.5 x 24 mm) effectively suppress EMI in next-generation applications.

  5. Microchip Expands dsPIC33A DSC Family For High-Density AI Data Center Power, Complex Motor Control And Intelligent Sensing 4/14/2026

    As AI servers, data centers, automotive and industrial systems demand higher efficiency designs, deterministic real-time control and quantum-resistant cryptography, Microchip Technology Inc. (Nasdaq: MCHP) has added dsPIC33AK256MPS306 Digital Signal Controllers (DSCs) to its dsPIC33A DSC family.

  6. Applied Materials Introduces Deposition Systems For Angstrom-Era Logic Chips 4/8/2026

    Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today introduced two chipmaking systems designed to create the smallest features in the world’s most advanced logic chips.

  7. Murata Begins Mass Production Of Seven Automotive MLCCs With World-Leading Capacitance For Their Rated Voltage And Size 4/8/2026

    Murata Manufacturing Co., Ltd has begun mass production of seven AEC-Q200-qualified multilayer ceramic capacitors (MLCCs) that achieve the world’s largest capacitance for a given rated voltage and size*, supporting stable operation of in-vehicle systems and greater design flexibility.

  8. Vishay Intertechnology Automotive Grade Photovoltaic MOSFET Driver Boosts Reliability And Lowers Costs In High Voltage Systems 4/1/2026

    Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new Automotive Grade photovoltaic MOSFET driver that is the first such device in the compact SMD-4 package to provide a creepage distance of 8 mm and mold compound with a comparative tracking index (CTI) of 600.

  9. Wonderful PCB Launches Advanced PCB Reverse Engineering And Cloning Services To Accelerate Electronics Innovation 3/25/2026

    Wonderful PCB, a leading provider of PCB manufacturing and assembly services, today announced the expansion of its PCB reverse engineering and PCB cloning services, designed to help global electronics manufacturers quickly rebuild design data from existing circuit boards and bring products to market faster.

  10. Interstate Connecting Components (ICC) Announces Addition Of Amphenol Fiber Systems VITA 87 High-Density MT Connectors 3/19/2026

    Interstate Connecting Components (ICC), a leading distributor of electronic components for the military and aerospace industries, announces a new product introduction of Amphenol Fiber Systems VITA 87 high-density circular MT connectors.