Latest Headlines

  1. OKI Develops 124-Layer PCB Technology For Next-Generation AI Semiconductor Testing Equipment 4/25/2025

    OKI Circuit Technology (“OTC”; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM (Note 1) mounted on AI semiconductors.

  2. Ansys Strengthens Collaboration With TSMC On Advanced Node Processes Certification And 3D-IC Multiphysics Design Solutions 4/23/2025

    Through continued collaboration with TSMC,  Ansys today announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions.

  3. Renesas Debuts New Group In Popular RA0 Series With Best-In-Class Power Consumption And Extended Temperature Range 4/22/2025

    Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, today introduced the RA0E2 microcontroller (MCU) Group based on the Arm Cortex-M23 processor.

  4. Microchip Launches High-Reliability BR235 And BR235D Series Of Power Relays For Demanding Military Applications 4/15/2025

    As a leading supplier to the aerospace and defense market, Microchip is committed to providing innovative and robust products that are designed for mission-critical performance in the most demanding environments.

  5. Navitas Announces Automotive Qualification Of High-Power GaNSafe™ ICs 4/15/2025

    Navitas Semiconductor (Nasdaq: NVTS), the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride (GaN) power ICs and silicon carbide (SiC) technology, has announced its high-power GaNSafe™ ICs achieve automotive qualification for both AEC-Q100 and AEC-Q101, showcasing GaN’s next inflection into the automotive market.

  6. Multilayer Ceramic Capacitors: TDK Offers MLCCs With The Industry's Highest Capacitance At 100V For Automotive Applications In 3225 Case Size 4/14/2025

    TDK Corporation has expanded its CGA series for automotive multilayer ceramic capacitors (MLCCs) to 10 µF at 100 V in 3225 size (3.2 x 2.5 x 2.5 mm – L x W x H), with X7R characteristics (Class Ⅱ dielectric).

  7. Adaptive Additive Manufacturing And Volumetric 3D Printing Combined In New APES And Manifest Technologies Partnership 4/8/2025

    Advanced Printed Electronic Solutions (APES) and Manifest Technologies have announced at the RAPID+TCT event in Detroit, Mich., a strategic partnership to integrate volumetric additive manufacturing (AM) into the new Matrix6D high-throughput adaptive AM platform from APES—unlocking a new era of high-speed, support-free 3D printing within a scalable, reconfigurable factory architecture.

  8. Siemens Acquires DownStream Technologies To Expand PCB Design-To-Manufacturing Flow 4/8/2025

    Siemens Digital Industries Software announced today that it has completed the acquisition of DownStream Technologies, a leading provider of manufacturing data preparation solutions for printed circuit board (PCB) design.

  9. Menlo Micro Releases To Production The MM5230 High Power RF Switch 4/4/2025

    Menlo Microsystems, Inc. (Menlo Micro), the company responsible for bringing to market the greatest electronic component innovation since the transistor with its Ideal Switch technology, released to production the MM5230, the company’s latest offering in a growing portfolio of small form-factor, ultra-high performance RF switches, setting a new standard for RF switching.

  10. Credo Unveils The Lark Family - Setting A New Benchmark For Low-Power 800G Optical DSPs 4/1/2025

    Credo Technology Group Holding Ltd (Credo) an innovator in providing secure, high-speed connectivity solutions that deliver improved reliability and energy efficiency, is proud to announce the release of the ultra-low power Lark optical Digital Signal Processor (DSP) family.