Latest Headlines

1. Infineon CIPOS Prime 1200V CoolSiC Power Modules, Now At Mouser, Deliver Best-In-Class Performance For EV/HEV Applications 6/18/2026

   Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the CIPOS Prime automotive CoolSiC power modules from Infineon Technologies.

2. Molex Expands Award-Winning AirBorn SInergy Modular High-Speed Hybrid Connectors With New High-Power Modules For All-In-One Connectivity 6/15/2026

   Molex, a global electronics leader and connectivity innovator, announces a significant expansion of its award-winning AirBorn SInergy Modular High-Speed Hybrid Connectors.

3. indie Launches Edge AI SoC To Power Smarter Perception Systems For Automotive And Humanoids 6/10/2026

   indie an automotive solutions innovator, today announced the release of iND881, its next-generation edge artificial intelligence (AI) system-on-chip (SoC), incorporating an AI compute engine to power smart cameras for automotive and robotic applications.

4. MicroPower Direct Expands EV Charging Power Portfolio With New 20W And 40W High-Voltage Isolated DC/DC Converters 6/9/2026

   MicroPower Direct (MPD), a Massachusetts-based supplier of AC/DC power supplies and DC/DC converters for OEM applications, has introduced two new high-voltage isolated DC/DC converters for EV charging infrastructure.

5. Ampleon Introduces High-Efficiency 5 GHz GaN Doherty Transistor Enabling Next-Generation Base Station Performance 6/8/2026

   Ampleon announces the C5H4850N55D, a high-efficiency 55 W GaN Doherty RF power transistor designed to meet the evolving demands of 5 GHz base station and multi-carrier communication systems.

6. Navitas Introduces Isolated Through-Hole Package For SiC MOSFETs, Enabling Direct-Cooled Thermal Management 6/8/2026

   Navitas Semiconductor (Nasdaq: NVTS), an industry leader in next-generation GaNFast^™ gallium nitride (GaN) and GeneSiC^™ silicon carbide (SiC) power semiconductors, today announced the launch of its new UHV-TO-247-4-ISO package, setting a new benchmark for high-performance discrete power devices.

7. Vishay Intertechnology 200 A Power Module Saves Space, Lowers Conduction Losses, And Increases Reliability In MHEVs And LEVs 6/3/2026

   Vishay Intertechnology, Inc. today introduced a new 200 A power module designed to save space and increase efficiency in 48 V traction inverters for light electric vehicles (LEV) and belt-start generator / recuperation systems for mild-hybrid electric vehicles (MHEV).

8. Murata Introduces World's First 2.2μF/100Vdc Soft-Termination Chip MLCC In 0805-Inch Size For Automotive Applications 6/3/2026

   Murata Manufacturing Co., Ltd. introduces the GCJ21BD72A225KE02, a soft-termination chip multilayer ceramic capacitor (MLCC) for automotive powertrain and safety equipment.

9. STMicroelectronics High-Performance Vibration Sensor With In-Sensor AI Offers A Compelling Alternative To Piezosensor To Fast-Growing Industrial Condition-Monitoring Market 6/3/2026

   STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, introduces an intelligent vibration sensor designed for industrial condition monitoring applications that require high accuracy, reliability, and energy efficiency.

10. VIAVI Introduces GNSS-Disciplined Oscillator For Precision Timing In Size, Weight And Power-Constrained Platforms 6/1/2026

    VIAVI Solutions Inc. (VIAVI) has announced the launch of the µPNT GDO-1000, a new GNSS-disciplined oscillator built in the M.2 B-key form factor.