Latest Headlines
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KYOCERA AVX Announces New MIL-PRF-32535 BME NP0 MLCCs Approved To The DLA QPD
2/15/2023
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is proud to announce that its MIL-PRF-32535 BME NP0 MLCCs have been approved to the Defense Logistics Agency (DLA) Qualified Products Database (QPD).
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Custom Capacitor Assemblies
2/15/2023
Passive Plus (PPI) offers Custom Capacitor Assemblies for high power requirements.
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Intelligent High-Side Switch From Diodes Incorporated Enables Assured Automotive System Reliability
2/14/2023
Diodes Incorporated (Diodes) has introduced the DIODES ZXMS81045SPQ, its first protected, automotive-compliant, high-side IntelliFET.
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TDK Offers Very Compact Snap-In Aluminum Electrolytic Capacitors With 85 Percent Increased Ripple Current Capability
2/9/2023
TDK Corporation (TSE:6762) presents its new EPCOS B43652* series of snap-in aluminum electrolytic capacitors that are characterized by very compact dimensions and very high ripple current-carrying capacity.
- Infineon QDPAK And DDPAK Top-Side Cooling Packages Registered As JEDEC Standard For High-Power Applications 2/9/2023
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Rheinmetall Joint Venture Wins First Customer With Multimillion-Euro Order For DC-Link Capacitors With Forward-Looking NanoLam Technology
2/7/2023
Rheinmetall PolyCharge GmbH, a joint venture of Rheinmetall AG and PolyCharge America, Inc., has received its first order in the mid double-digit million euro range one year after it was founded. Its first customer, a well-known, globally operating supplier to the automotive industry, has ordered two different DC-link capacitors for applications in the 900V range, which are produced with the innovative NanoLam technology.
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New Advanced SPICE Model For ESD Diodes Addresses Challenges In IC Design And Protection
2/7/2023
The Silicon Integration Initiative Compact Model Coalition is proud to announce the release of the ASM-ESD diode model, a new electrostatic discharge compact modeling standard that aims to improve the reliability of integrated circuits.
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Toshiba Releases Intelligent Power Devices That Help Reduce Mounting Areas
2/6/2023
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched two intelligent power devices that control the drive of the inductive loads of motors, solenoids, lamps and other devices used in applications such as the programmable logic controllers of industrial equipment.
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Vishay Intertechnology Automotive Grade vPolyTan Polymer Tantalum Chip Capacitors Combine Low ESR With High Volumetric Efficiency
2/1/2023
Vishay Intertechnology, Inc. today introduced a new Automotive Grade series of vPolyTan surface-mount polymer tantalum molded chip capacitors.
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Silicon Mitus Develops Ultra Small High Frequency Silicon Capacitor
1/31/2023
Silicon Mitus (CEO Youm Huh), an advanced specialist in Power Management Integrated Circuit (PMIC) and analog semiconductors, announced on 31st that it has developed an ultra-small silicon capacitor for high frequency and delivered samples for evaluation to its customers.