SENKO Advanced Components, Inc. (SENKO) announced today there have been major advancements in the adoption and continued deployment of its SN® Connector technology and supporting ecosystem after two years of field trials
Alpha and Omega Semiconductor Limited (AOS) a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today announced the release of the new 1200V silicon carbide (SiC) αSiC MOSFET technology platform
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched “TPD7107F,” a gate driver switch IPD that controls the conduction and shut-off of current supplied to automotive electronic control units (ECUs), such as junction boxes and body control modules
DuPont Electronics & Imaging Interconnect Solutions (ICS), the leading integrated materials solution partner for advanced interconnects, today introduced new metallization offerings in advanced development stages for High-Density Interconnect (HDI) applications, a high-performance and fast-growing segment of the printed circuit board (PCB) industry
Nano Dimension Ltd. (Nasdaq, TASE: NNDM), a leading Additively Manufactured Electronics (AME)/PE (Printed Electronics) provider and REHAU, a worldwide-leading polymer manufacturer, announced today that they succeeded in printing a 3D touch sensor
Fairview Microwave Inc., an Infinite Electronics brand and a leading provider of on-demand RF, microwave and millimeter wave components, has introduced a new series of double ridge waveguide electromechanical relay switches that perform over broader frequency bands.