Latest Headlines
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Mitsubishi Electric To Ship Samples Of S1-Series HVIGBT Module
12/22/2024
Mitsubishi Electric Corporation announced today that it will begin shipping samples of two new S1-Series High Voltage Insulated Gate Bipolar Transistor (HVIGBT) modules, both rated at 1.7kV, for large industrial equipment such as railcars and DC power transmitters from December 26.
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Richardson Electronics, Ltd. Announces Two Multi-Million Dollar Contracts For Its Patented Ultracapacitor Pitch Energy Modules
12/17/2024
Richardson Electronics, Ltd. (NASDAQ: RELL), a global provider of engineered solutions for renewable energy and other power management applications, announced today two multi-million dollar production contracts with two of the world's largest owners and operators of wind farms in North America for Richardson’s patented ultracapacitor pitch energy modules (PEMs) and other related products.
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KYOCERA AVX Releases Industry's Highest Power 0603 Resistor
12/12/2024
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, expanded its selection of CR Series high-power chip resistors with the addition of the industry’s highest power 0603 resistor.
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Inductors: TDK Launches The Industry's Smallest Thin-Film Power Inductors
12/12/2024
TDK Corporation announces the introduction of its new PLE856C Series (0.80 x 0.45 x 0.65 mm; L x W x T) of compact thin-film power inductors for wearable devices. Mass production of these new components began this month, in December 2024.
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OKI Develops Printed Circuit Board Technology With Stepped Copper Coin Insertion To Achieve 55 Times Better Heat Dissipation In Outer Space
12/11/2024
The OKI Group printed circuit board (PCB) business company OKI Circuit Technology (President: Masaya Suzuki; Headquarters: Tsuruoka City, Yamagata Prefecture; “OTC” hereinafter) has successfully developed multi-layer PCB technology with stepped copper coin insertion (“stepped copper coin” hereinafter) to achieve 55 times better heat dissipation compared to conventional PCB (Note 1).
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Vishay Intertechnology 1 Form A Solid-State Relay Offers 600 V Load Voltage And Isolation Voltage Of 3750 VRMS In SOP-4 Package
12/11/2024
Vishay Intertechnology, Inc. today introduced a 1 Form A solid-state relay offering a 600 V load voltage and isolation voltage of 3750 VRMS in the low profile SOP-4 package.
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Laser Photonics Advances PCB Marking Technology R&D For Electronics And Semiconductor Manufacturing
12/10/2024
Laser Photonics Corporation, a leading global developer of industrial laser systems for cleaning and other material processing applications, and its recently acquired subsidiary, Control Micro Systems, Inc.(CMS), announced today the expansion of their Printed Circuit Board (PCB) Marking technology development program targeting the semiconductor and electronics market.
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ROHM's EcoSiC Technology Has Been Adopted In COSEL's HFA/HCA Series Of 3.5kW Output AC-DC Power Supply Units
12/4/2024
ROHM has announced the adoption of its EcoSiC products, including SiC MOSFETs and SiC Schottky barrier diodes (SBDs) in the HFA/HCA series of 3.5kW output AC-DC power supply units for 3-phase applications from COSEL, a leading power supply manufacturer in Japan. Incorporating ROHM SiC MOSFETs and SiC SBDs into the forced air-cooled HFA series and conduction-cooled HCA series achieves up to 94% efficiency.
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AKM Starts Mass Production And Shipment Of Its Smallest And Thinnest Hall Element For High-Precision Position Detection
12/4/2024
Asahi Kasei Microdevices (AKM) has launched mass production and shipment of its next-generation InAs (indium arsenide) compound Hall element, the HQ0A11.
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Polymatech Electronics Partners With South Wales SME 'SimplyRFMW' To Advance 5G And 6G RF Power Amplifier Designs
11/28/2024
Polymatech Electronics, a global pioneer in semiconductor chip manufacturing headquartered in Chennai, India, has announced a strategic partnership with SimplyRFMW Limited, a South Wales-based SME renowned for its expertise in RF and microwave engineering.