Latest Headlines

  1. DC Power Connectors From Amphenol GEC 5/27/2025

    TME's product range has been expanded to include PowerLok power connectors from Amphenol GEC.

  2. Vishay Intertechnology Thick Film Power Resistor With Optional NTC Thermistor And PC-TIM Simplifies Designs And Saves Board Space 5/23/2025

    Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new AEC-Q200 qualified thick film power resistor in the compact, low profile SOT-227B package for mounting on a heatsink.

  3. Siemens Democratizes AI-Driven PCB Design For Small And Medium Electronics Teams 5/21/2025

    Siemens Digital Industries Software announced today that it is making its AI-enhanced electronic systems design technology more accessible to small and mid-sized businesses (SMB) with PADS Pro Essentials software and Xpedition Standard software.

  4. DrayTek Selects MaxLinear 2.5G Ethernet Switches For Multi-Port Networking Web-Management Switches 5/19/2025

    MaxLinear, Inc. a global leader in wired network solutions, today announced that DrayTek, a leading developer of high performance networking equipment, has selected the MxL86252S and MxL86282S 2.5G Ethernet Switch SoCs for its next generation 7- and 10-port Ethernet switches.

  5. Interstate Connecting Components (ICC) Announces Value-Added Assembly Of Amphenol Aerospace High-Speed D38999 Series III Connectors 5/15/2025

    Interstate Connecting Components (ICC), a leading distributor of electronic components for the military and aerospace industries, announces expanded support of value-added assembly of Amphenol Aerospace high-speed connectors.

  6. KYOCERA AVX Launches New CP2816 Series High-Directivity Couplers 5/7/2025

    KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new CP2816 Series integrated thin film (ITF) high-directivity couplers for high-frequency wireless systems.

  7. Power Integrations' 1700 V Switcher IC Delivers Reliability And Space-Saving Benefits In 800 V BEVs 5/6/2025

    PCIM 2025 – Power Integrations the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced five new reference designs targeting 800 V automotive applications based on the company’s 1700 V InnoSwitch 3-AQ flyback switcher ICs.

  8. Alpha And Omega Semiconductor Enables 48V Hot Swap In AI Servers With New High SOA MOSFET 5/1/2025

    Alpha and Omega Semiconductor Limited (AOS) , a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced its AOTL66935 utilizes AOS’ 100V AlphaSGT proprietary MOSFET technology which combines the advantages of trench technology for low on-resistance with high safe operating area (SOA) capability that meets 48V hot swap requirements in AI server and telecom applications.

  9. ROHM's Latest 2kV SiC MOSFETs Integrated Into Semikron Danfoss' Module For SMA's Large-Scale Power Conversion System 4/28/2025

    ROHM Semiconductor today announced that SMA Solar Technology AG, a leading global specialist in photovoltaic and storage system technology, has adopted Semikron Danfoss’ Module featuring ROHM’s latest 2kV SiC MOSFETs for its new large-scale power conversion solution “Sunny Central FLEX.”

  10. OKI Develops 124-Layer PCB Technology For Next-Generation AI Semiconductor Testing Equipment 4/25/2025

    OKI Circuit Technology (“OTC”; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM (Note 1) mounted on AI semiconductors.